Recent progress on thermally conductive insulating composites with three-dimensional filler network

被引：0
|
作者：
Zhehao Z. [1 ,2 ]
Yudong D. [1 ,2 ]
Xun Z. [1 ,2 ]
Hong W. [1 ,2 ]
Min C. [1 ,2 ]
Qiang L. [1 ,2 ]
机构：
[1] Key Laboratory of Low-grade Energy Utilization Technologies and Systems (Chongqing University), Ministry of Education, Chongqing
[2] Institute of Engineering Thermophysics, Chongqing University, Chongqing
来源：
Huagong Jinzhan/Chemical Industry and Engineering Progress | 2023年 / 42卷 / 12期
关键词：
composites; fillers; heat conduction; insulation; simulation;
D O I：
10.16085/j.issn.1000-6613.2023-0100
中图分类号：
学科分类号：
摘要：
The composite material with three-dimensional (3D) packing network has excellent thermal conductivity, which is one of the ideal materials to solve the problem of heat dissipation of electronic devices and is widely used in the field of thermal insulation materials. This paper described the important research progress of 3D thermal insulating polymer materials at home and abroad in recent years. Firstly, starting from the preparation method of 3D filler structure, it introduced the main ways to prepare 3D thermal insulating composite materials, including template method, foam method, 3D printing method, composite particle method and polymer frame method, and analyzed the forming mechanism of different construction methods. The advantages and disadvantages of each preparation method were introduced. Secondly, the finite element simulation of 3D heat conduction network was summarized, and the heat conduction models commonly used at present were analyzed. Finally, the bottleneck and future development direction in the preparation of thermal insulating composite materials with 3D network structure were described, including the elaboration and free construction of 3D filler network, the treatment of the interface thermal resistance between 3D filler structure and polymer, the establishment of a general heat conduction model of 3D filler network and the reduction of process difficulty. It provided the direction and idea for the research and application of high thermal conductivity insulating composites. © 2023 Chemical Industry Press. All rights reserved.
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页码：6419 / 6428
页数：9
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