Modulating cross-linked network structure of epoxy resin blends towards concurrently high intrinsic thermal conductivity and dielectric properties

被引:7
|
作者
Di-wu, Jingyu [1 ]
Zhou, Wenying [1 ]
Wang, Yun [1 ]
Li, Ying [2 ]
Liang, Yaodong [1 ]
Zhang, Ruotong [1 ]
Meng, Xiangchuan [1 ]
Song, Chuanrui [1 ]
Wang, Yiru [1 ]
Chen, Qingguo [3 ]
机构
[1] Xian Univ Sci & Technol, Sch Chem & Chem Engn, Xian 710054, Peoples R China
[2] Xian Univ Sci & Technol, Sch Mat Sci & Engn, Xian 710054, Peoples R China
[3] Harbin Univ Sci & Technol, Key Lab Engn Dielect & Its Applicat, Minist Educ, Harbin 150080, Peoples R China
基金
中国国家自然科学基金;
关键词
Epoxy; Thermal conductivity; Dielectric properties; Ordered domains; Phonon transport;
D O I
10.1007/s10965-024-04042-z
中图分类号
O63 [高分子化学(高聚物)];
学科分类号
070305 ; 080501 ; 081704 ;
摘要
High thermal conductivity (k) epoxy resin (EP) composites are widely used in electronic devices and power equipment where timely heat dissipation is urgently desirable. However, achieving a balance between high-k values and excellent dielectric properties such as breakdown strength (Eb) is challenging, which subsequently affects their applications in high-voltage fields. Enhancing the intrinsic k of cured EP is the key to addressing this dilemma. Along this line, in this work, a liquid crystal (LC) epoxy (LCE, BE) with biphenyl mesogenic unit was synthesized and introduced into commonly used EP E-51 to currently promote the k and Eb of the blends. The findings demonstrate that the EP blends' k increases with the BE loading due to the formation of multi-scale ordered domains resulting from the self-assembly of biphenyl mesogenic units, which establish the heat-conductive channels for phonon transport. These ordered domains further induce charge traps and efficiently impede the migration of charge carriers. So, the simultaneous enhancement of k and Eb along with low dielectric permittivity and loss are achieved in the E-51/BE blends. Moreover, two curing agents also affect the structure, thermal and dielectric performances of the blends. The prepared BE/E-51 blends with enhanced k and Eb showcase potential applications as thermal management materials in microelectronic devices and electrical power systems.
引用
收藏
页数:17
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