4H-SiC/SiO2 Interface Degradation in 1.2 kV 4H-SiC MOSFETs Due to Power Cycling Tests

被引:0
作者
Yoo, Dahui [1 ]
Kim, Mijin [2 ]
Kang, Inho [3 ]
Lee, Ho-Jun [1 ]
机构
[1] Pusan Natl Univ, Dept Elect Engn, Busan 46284, South Korea
[2] Samsung Elect, Qual Team Test & Syst Package, Asan 31489, South Korea
[3] Korean Electrotechnol Res Inst, Chang Won 51543, South Korea
关键词
power cycling test; 4H-SiC; interface; TEMPERATURE; SEMICONDUCTOR; RELIABILITY; NOISE;
D O I
10.3390/electronics13071267
中图分类号
TP [自动化技术、计算机技术];
学科分类号
0812 ;
摘要
Power cycling tests (PCTs) assess the reliability of power devices by closely simulating their operating conditions. A PCT was performed on commercially available 1.2 kV 4H-SiC power metal-oxide-semiconductor field-effect transistors to observe its impact on the 4H-SiC/SiO2 interface. High-resolution transmission electron microscopy and electron energy loss spectroscopy measurements showed variations in the length of the 4H-SiC/SiO2 transition layer, depending on whether the device was power cycled. Moreover, the total resistance at V-g >> V-t in R-tot - (V-g-V-t)(-1) graph increased to 16.5%, while it changed more radically to 47.3% at V-g approximate to V-t. The threshold voltage shifted negatively. These variations cannot be expected solely through the wearout of the package.
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页数:11
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