Influence of Closing Joints of Epoxy Resin Insulator on Water Diffusion Test

被引:0
作者
Fan H. [1 ]
Liu Y. [1 ]
Wang L. [1 ]
Zhang F. [2 ]
Wang T. [2 ]
Zeng X. [2 ]
机构
[1] International Graduate School at Shenzhen, Tsinghua University, Shenzhen
[2] South China Electric Power Research Institute Co., Ltd., Guangzhou
来源
Dianwang Jishu/Power System Technology | 2021年 / 45卷 / 06期
基金
中国国家自然科学基金;
关键词
Closing joint; Epoxy resin insulator; Hydrolysis of epoxy resin; Hygrothermal aging; Water diffusion test;
D O I
10.13335/j.1000-3673.pst.2020.0405
中图分类号
学科分类号
摘要
Because of its excellent electrical performance and good adhesion between core and sheath, cycloaliphatic epoxy resin insulator is expected to be widely used in transmission lines. Because of the automatic pressure gel forming process, there are two vertical joints on the epoxy resin insulators. In order to study the water resistance of epoxy resin insulator, the leakage current is measured in this paper referring to the water diffusion test method. It is found that the effective value of the leakage current of epoxy resin insulator increases abnormally due to the joints, and the phase difference between the voltage and the leakage current decreases rapidly with the boiling time. To find the reasons, TGA, FTIR, SEM and EDS tests are carried out on the joint and the non-joint areas before and after boiling. It is found that more SiO2 fillers are contained on the joints, which makes the epoxy resin matrix and the interface between the matrix and the fillers more vulnerable to the damage in the hot and humid environment in the process of boiling, so that the insulation of the epoxy resin composite at the joints will be reduced. The filler distribution at the closing joints can be effectively improved by adjusting the relative positions of the molds of the insulators and increasing the fluidity of the epoxy resin insulator sheath material in the molds during the forming process, then the abnormal increase of water diffusion leakage current can be avoided. © 2021, Power System Technology Press. All right reserved.
引用
收藏
页码:2420 / 2426
页数:6
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