Degradation Mechanisms of Gate Leakage in GaN-Based HEMTs at Low Dose Rate Irradiation

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作者
Li, Xiaolong [1 ]
Wang, Xin [1 ]
Liu, Mohan [1 ]
Zhu, Kunfeng [2 ]
Shui, Guohua [2 ]
Zheng, Qiwen [1 ]
Cui, Jiangwei [1 ]
Lu, Wu [1 ]
Li, Yudong [1 ]
Guo, Qi [1 ]
机构
[1] Xinjiang Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Key Laboratory of Functional Materials and Devices for Special Environments, Ürümqi,830011, China
[2] Science and Technology on Analog Integrated Circuit Laboratory, Chongqing,400000, China
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Degradation;
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摘要
In this paper, we investigated an experimental analysis of the degradation caused by low dose rate irradiation in GaN-based high-electron-mobility transistors (HEMTs) with a p-type gate. Combined with experimental frequency-dependent conductance (Gp/?) analyses and TCAD simulations, it has been demonstrated that the negative shifts in both Id-Vgs and Vth are primarily due to the formation of donor-like traps near the p-GaN/AlGaN interface, which is a result of the dehydrogenation of pre-existing defects during low dose rate irradiation. Additionally, the results of the TCAD simulations, indicate that the trap-assisted tunneling (TAT) process, which involves the recombination of trap-assisted holes with electrons in the p-GaN layer, may dominate the physical mechanisms responsible for the increase in gate leakage current (Ig-Vgs). These results may provide a basis for understanding the role of radiation-induced traps on electrical parameters degradations for p-GaN gate HEMTs. © 2013 IEEE.
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页码:35410 / 35416
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