Infra-Red Intelligent Surface for Near-Field Touchless Displays

[1] Elenius P., Levine L., Comparing flip-chip and wire-bond interconnection technologies, Chip Scale Review, 4, 6, pp. 81-87, (2000)

[2] Xia J., Dong X., Yao Z., Sheng C., Li Z., Cao X., Wang C., Duan L., Development of high-yield laser lift-off process for micro LED Display, SID Symposium Digest of Technical Papers, 51, 1, pp. 1312-1314, (2020)

[3] Schuele P., Ulmer K., Sasaki K., Lee J.-J., Making microLED displays with a fluidic assembly process, (2020)

[4] Gan R., Liang J., Ahmad B.I., Godsill S., Modeling intent and destination prediction within a Bayesian framework: Predictive touch as a usecase, Data-Centric Engineering, 1, (2020)

[5] (2019)

[1] Elenius P., Levine L., Comparing flip-chip and wire-bond interconnection technologies, Chip Scale Review, 4, 6, pp. 81-87, (2000)

[2] Xia J., Dong X., Yao Z., Sheng C., Li Z., Cao X., Wang C., Duan L., Development of high-yield laser lift-off process for micro LED Display, SID Symposium Digest of Technical Papers, 51, 1, pp. 1312-1314, (2020)

[3] Schuele P., Ulmer K., Sasaki K., Lee J.-J., Making microLED displays with a fluidic assembly process, (2020)

[4] Gan R., Liang J., Ahmad B.I., Godsill S., Modeling intent and destination prediction within a Bayesian framework: Predictive touch as a usecase, Data-Centric Engineering, 1, (2020)

[5] (2019)