共 27 条
[1]
Karlsson B., Larsson L.-E., Homogenization by two-phase diffusion, Mater. Sci. Eng., 20, pp. 161-170, (1975)
[2]
Haidemenopoulos G.N., Physical Metallurgy: Principles and Design, pp. 176-179, (2018)
[3]
Illingworth T.C., Golosnoy I.O., Clyne T.W., Modelling of transient liquid phase bonding in binary systems - A new parametric study, Mater. Sci. Eng., 445-446, pp. 493-500, (2007)
[4]
Illingworth T.C., Golosnoy I.O., Numerical solutions of diffusion-controlled moving boundary problems which conserve solute, J. Comput. Phys., 209, pp. 207-225, (2005)
[5]
Crank J., The Mathematics of Diffusion, pp. 310-313, (1975)
[6]
Asthana R., An analysis for moving boundary diffusion controlled growth in a finite domain with a concentration-dependent diffusion coefficient, J. Colloid Interface Sci., 158, pp. 146-151, (1993)
[7]
Nakagawa H., Lee C., North T., Modeling of base metal dissolution behavior during transient liquid-phase brazing, Metall. Trans., 22, pp. 943-955, (1991)
[8]
Zhou Y., North T.H., Kinetic modelling of diffusion-controlled, two-phase moving interface problems, Modell. Simul. Mater. Sci. Eng., 1, 4, pp. 505-516, (1993)
[9]
Shinmura T., Ohsasa K., Narita T., Isothermal solidification behaviour during the transient liquid phase bonding process of nickel using binary filler metals, Mater. Trans., 42, pp. 292-297, (2001)
[10]
Li J.F., Agyakwa P.A., Johnson C.M., A fixed-grid numerical modelling of transient liquid phase bonding and other diffusion-controlled phase changes, J. Mater. Sci., 45, pp. 2340-2350, (2010)