A review on copper alloys with high strength and high electrical conductivity

被引:72
作者
Mao, Qingzhong [1 ]
Liu, Yanfang [2 ]
Zhao, Yonghao [1 ,2 ]
机构
[1] Nanjing Univ Sci & Technol, Nano & Heterogeneous Mat Ctr, Sch Mat Sci & Engn, Nanjing 210094, Peoples R China
[2] Hohai Univ, Sch Mat Sci & Engn, Changzhou 213200, Peoples R China
基金
中国国家自然科学基金; 中国博士后科学基金;
关键词
Copper and copper alloy; Strength; Conductivity; Microstructure; Trade-off; CR-ZR ALLOY; NANOTUBE-REINFORCED COPPER; CU-AG; PLASTIC-DEFORMATION; MICROSTRUCTURE; RESISTIVITY; EVOLUTION; DUCTILITY; HARDNESS; COMBINATION;
D O I
10.1016/j.jallcom.2024.174456
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
With the rapid development of modern industry, there is an urgent need for copper alloys with high strength and high conductivity (HSHC). Unfortunately, the HSHC of metals are incompatible, and even mutually exclusive because conventional strengthening mechanisms including grain-refinement, solutes, precipitates and deformation routinely enhance the yield strength accompanying with electron scattering effect and conductivity loss. This brief review first analyzes four strengthening principles and their effects on the electrical conductivity of copper and its alloys, then, systematically summarizes various strategies to enhance strength and electrical conductivity. Finally, the recent research progress of some typical HSHC copper alloys is induced. Overall, microstructure regulation, precipitation strengthening, and multiple strengthening are proven methods to increase the performance of HSHC copper alloys. Meanwhile, machine learning has shown strong potential in the design of HSHC copper alloys.
引用
收藏
页数:20
相关论文
共 102 条
[1]   MECHANICAL PROPERTY AND CONDUCTIVITY CHANGES IN SEVERAL COPPER-ALLOYS AFTER 13.5 DPA NEUTRON-IRRADIATION [J].
AMES, M ;
KOHSE, G ;
LEE, TS ;
GRANT, NJ ;
HARLING, OK .
JOURNAL OF NUCLEAR MATERIALS, 1986, 141 :174-178
[2]   Spinodal-modulated solid solution delivers a strong and ductile refractory high-entropy alloy [J].
An, Zibing ;
Mao, Shengcheng ;
Yang, Tao ;
Liu, Chain Tsuan ;
Zhang, Bin ;
Ma, Evan ;
Zhou, Hao ;
Zhang, Ze ;
Wang, Lihua ;
Han, Xiaodong .
MATERIALS HORIZONS, 2021, 8 (03) :948-955
[3]   A review of recent developments in the corrosion performance of aluminium matrix composites [J].
Aydin, Fatih .
JOURNAL OF ALLOYS AND COMPOUNDS, 2023, 949
[4]   Strengthening Effect of Ag Precipitates in Cu-Ag Alloys: A Quantitative Approach [J].
Bao, Guohuan ;
Xu, Yuqing ;
Huang, Liuyi ;
Lu, Xiaopei ;
Zhang, Lei ;
Fang, Youtong ;
Meng, Liang ;
Liu, Jiabin .
MATERIALS RESEARCH LETTERS, 2016, 4 (01) :37-42
[5]   Structural evolutions of metallic materials processed by severe plastic deformation [J].
Cao, Yang ;
Ni, Song ;
Liao, Xiaozhou ;
Song, Min ;
Zhu, Yuntian .
MATERIALS SCIENCE & ENGINEERING R-REPORTS, 2018, 133 :1-59
[6]   High Strength and Electrical Conductivity of UFG Copper Alloys [J].
Champion, Y. ;
Couzinie, J-P ;
Tusseau-Nenez, S. ;
Brechet, Y. ;
Islamgaliev, R. K. ;
Valiev, R. Z. .
NANOMATERIALS BY SEVERE PLASTIC DEFORMATION: NANOSPD5, PTS 1 AND 2, 2011, 667-669 :755-+
[7]   Achieving a better combination of strength and electrical conductivity of Cu-Al2O3 nanocomposites by accumulative roll-bonding to ultrahigh cycles [J].
Chen, F. ;
Mei, Q. S. ;
Li, C. L. ;
Wan, L. ;
Shao, H. H. ;
Li, J. Y. ;
Mei, X. M. ;
Chen, Z. H. ;
Zhang, G. D. .
MATERIALS CHARACTERIZATION, 2021, 178
[8]   Electrical resistivity of ultrafine-grained copper with nanoscale growth twins [J].
Chen, X. H. ;
Lu, L. ;
Lu, K. .
JOURNAL OF APPLIED PHYSICS, 2007, 102 (08)
[9]   High Plasticity and Substantial Deformation in Nanocrystalline NiFe Alloys Under Dynamic Loading [J].
Cheng, Sheng ;
Zhao, Yonghao ;
Guo, Yazhou ;
Li, Ying ;
Wei, Qiuming ;
Wang, Xun-Li ;
Ren, Yang ;
Liaw, Peter K. ;
Choo, Hahn ;
Lavernia, Enrique J. .
ADVANCED MATERIALS, 2009, 21 (48) :5001-+
[10]   Strengthening mechanisms and work hardening in a heterostructured cast aluminum alloy under compressive loading: Correlation with nanomechanical properties [J].
Dash, S. S. ;
Liu, Z. Y. ;
Zou, Y. ;
Li, D. J. ;
Zeng, X. Q. ;
Li, D. Y. ;
Chen, D. L. .
JOURNAL OF ALLOYS AND COMPOUNDS, 2023, 968