Microstructural evolution and mechanisms affecting the mechanical properties of wire arc additively manufactured Al-Zn-Mg-Cu alloy reinforced with high-entropy alloy particles

The mechanical properties of Al-Zn-Mg-Cu alloys produced via wire arc additive manufacturing (WAAM) are often weakened by the presence of continuous and coarse precipitated phases, which significantly limits their practical applications. In this study, high -entropy alloy (HEA) particles were incorporated into Al-Zn-Mg-Cu alloy during the WAAM process, which inhibits the continuity of precipitated phase, and the mechanism of microstructure evolution and macroscopic mechanical properties optimization of the components are explored. The results show that HEA particles promote grain refinement, and disrupt the formation of continuous precipitated phase along the grain boundary by generating plenty of fine spot -like precipitated phases, thus inhibiting grain boundary segregation. The spot -like precipitated phases are connected via a slender second -phase -band. The primary precipitates include the metastable eta', stable eta, and T phases, and the diffusion of solute atoms forms the Al 3 Ni and Al 3 (Ni, Cu) 2 phases. The tensile strength increases from 247.4 +/- 5.9 MPa to 326.2 +/- 19.7 MPa in the horizontal direction and from 273.0 +/- 13.7 MPa to 335.4 +/- 11.1 MPa in the vertical direction, which correspond to increases of 31.9 % and 22.9 % respectively. The enhancement of mechanical properties is mainly attributed to Hall-Petch, Orowan, load -transfer, solid -solution and dislocation strengthening mechanisms. Only slight variation occurred in the elongation, the increased number of fine spot -like precipitated phases and grain boundaries hinder the crack propagation, while the increased number of pores facilitates the crack propagation, and these effects almost balance each other out in competition. These findings are expected to provide new insights into the microstructure optimization of WAAM components, thereby meeting more practical applications.