Effect of Mn addition in W-Ni-Cu heavy alloy processed through hot press sintering techniques on microstructure, microtexture and grain boundary character evolution

被引:5
作者
Manikandan, R. [1 ]
Annamalai, Raja A. [2 ]
机构
[1] Vellore Inst Technol, Sch Mech Engn, Vellore 632014, India
[2] Vellore Inst Technol, Ctr Innovat Mfg Res, Vellore 632014, India
关键词
W-Ni-cu-Mn heavy alloy; Hot press sintering; micro-texture and grain boundary distribution; WHAs electrical conductivity; RECRYSTALLIZATION TEXTURES; MECHANICAL-PROPERTIES; LIQUID-PHASE; NUCLEATION; KINETICS; GROWTH;
D O I
10.1016/j.matchar.2024.113808
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In this current study, the impact of manganese addition to 93 W-4.9Ni-2.1Cu-xMn (where x = 1, 2, 3, and 4 Wt%) on the microstructure, texture development, and grain boundary character distribution of tungsten heavy alloy (WHAs) was examined. The samples were produced through a vacuum hot press sintering, with parameters 50 MPa pressure, 10 C/min heating rate, and 1450 C sintering temperature for 20 min holding duration. To study the influence of manganese on the texture development and microstructure in conventional WHAs, electron backscatter diffraction (EBSD) was employed. The important findings from the EBSD analysis reveal that fibre texture (001) 111 and a higher fraction of low -angle grain boundaries in the Mn unalloyed compact resulted from extensive atomic jumps between the particles at elevated temperatures. Further texture analysis on the Mnadded compacts reveals that manganese oxide (MnO) formation during liquid phase sintering led to lower densification and randomized weak fibre texture development in manganese -alloyed compacts. In addition, the texture degradation in Mn-added compacts is mainly caused by recrystallization followed by sub -structural recovery during liquid phase sintering. This study indicates that increasing manganese content in WHAs stoichiometry led to a heterogeneous distribution of binder matrix (Ni-Cu) in the sintered compact. As a result, W4.9Ni-2.1Cu-4Mn alloy revealed decreased relative density (90.70%), microhardness (389.5 HV0.5), and electrical conductivity (15.74% of IACS).
引用
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页数:14
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