Research on Cutting Force Model of Diamond Wire Saw with Single Crystal Silicon Swing

Material pendulum assisted multi diamond wire sawing technology is an effective technology to realize cutting hard and brittle materials with high precision and high efficiency. It is of great practical significance to explore the quantitative relationship among the parameters, cutting force and chip quality. The length variation formula of cutting line with the influence of wire bow has been deduced on the basis of researching diamond wire trajectory, and the theoretical model of diamond wire sawing with single crystal silicon swing has been established and verified combined with indentation fracture mechanics and experiments. The analysis of the influence of cutting force under different parameters has conducted, and the results show that the cutting length can be reduced by nearly 50% with the aid of pendulum. The swing angle has little effect on the maximum cutting force, but it can affect the extreme range of cutting force in the "sawtooth wave" period, and the swing angle velocity has a greater impact on the "sawtooth wave" period. The cutting force increases with the increase of feed rate under the condition of constant feed rate, and the maximum cutting force can be reduced by about 12% under the condition of variable feed rate. After further experiments of multi diamond wire slicing with swing angles of 0°, 3°, 5° and 7°, the results show that diamond wire sawing with single crystal silicon swing can reduce the defects of material surface damage and deep pits. Compared with the 0°experiment, the silicon wafer with a swing angle of 5°reduces the roughness by 30.1% and the thickness of the hardened layer by 20.1%. © 2021 Journal of Mechanical Engineering.