Basic electrical characteristics of epoxy/hollow silica composites influenced by addition of hollow silica

被引:0
作者
Murakami Y. [1 ]
Matsubara T. [1 ]
Kawashima T. [1 ]
Hozumi N. [1 ]
机构
[1] Department of Electrical and Electronic Information Engineering, Toyohashi University of Technology, 1-1, Hibarigaoka, Tempaku-cho, Toyohashi
基金
日本学术振兴会;
关键词
Composite; Dielectric breakdown; Epoxy resin; Hollow silica; Partial discharge;
D O I
10.1541/ieejfms.139.387
中图分类号
学科分类号
摘要
Polymeric insulating materials like an epoxy resin due to their excellent electric performance and a maintenance performance are commonly applied to various power equipment. Additives and fillers are traditionally added into the epoxy resin to improve the mechanical and thermal properties. The epoxy/hollow particle composites have been developed to produce the composite material which has new function like the low dielectric constant, the lightweight, and the high heat insulation. To understand the basic electrical properties of epoxy/hollow silica composites, the capacitance measurement, the breakdown test and the partial discharge measurements were performed. The breakdown strength of the epoxy/hollow silica composites and the breakdown strength of the epoxy/no hollow silica (normal silica) composites were almost the same regardless of the applied voltage waveform. The AC breakdown voltage at the 0-peak of the epoxy/hollow silica composites also agreed with the DC breakdown voltage of that. Furthermore, the PDIV of the epoxy/hollow silica composites was almost the same compared to that of epoxy/normal silica composites. The continuous partial discharge in the hollow region did not cause the breakdown, and the existence of the interface between the silica particle and the epoxy resin might lead to the breakdown. © 2019 The Institute of Electrical Engineers of Japan.
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收藏
页码:387 / 392
页数:5
相关论文
共 13 条
[1]  
Okazaki Y., Tominaga T., Kozako M., Ohtsuka S., Hikita M., Effects of preparation process for thermal conductivity and breakdown strength of epoxy/ alumina micro-composites, 2010 National Convention Record IEE Japan, (2010)
[2]  
Yoshida T., Kurimoto M., Manabe Y., Funabashi T., Kato T., Suzuoki Y., Evaluation of particle porosity and dielectric properties of nanoballoon silica/ epoxy composite, The Papers of Technical Meeting, IEE Japan, pp. 7-10, (2016)
[3]  
Kessler M., Schnettler A., Investigation of the DC breakdown mechanism in elastic syntactic foams, IEEE Trans. Dielectr. & Electr. Insul., 17, 3, pp. 898-905, (2010)
[4]  
Strauchs A., Mashki A., Schnettler A., Effects of SiO<sub>2</sub> nanofiller on the properties of epoxy resin based syntactic foam, IEEE Trans. Dielectr. & Electr. Insul., 19, 2, pp. 400-407, (2012)
[5]  
Ishida K., Matsuoka T., Kojima H., Hayakawa N., Partial discharge inception characteristics of low dielectric loss materials for high-voltage HTS cable, Proc. Of 2015 Annual Conference of Power & Energy Society, IEE Japan, (2015)
[6]  
Raju G.G., Dielectrics in Electric Fields, pp. 80-81, (2013)
[7]  
Abe S., Kawashima T., Nagao M., Hozumi N., Murakami Y., Miyakawa N., Shiota H., Tsurimoto T., Electrical treeing characteristics near multi-layer interface, Conference on Electrical Insulation and Dielectric Phenomena, 8 C-3, pp. 741-744, (2017)
[8]  
Seng T.K., Geok T.K., Ghani H.A., Kit C.J., Hong L.L., Microstrip antenna design for ultra-wideband frequency, International Conference on Robotics, Automation and Sciences, (2017)
[9]  
Inui A., Yamada S., Murase H., Teranishi T., Ohshim I., Impulse insulation characteristics of a composite insulation system having a wedge gap in SF<sub>6</sub> gas, T. IEE Japan, 112 A, 2, pp. 106-114, (1992)
[10]  
Kurimoto M., Murakami Y., Nagao M., Lower permittivity characteristic of mesoporous-alumina/epoxy composite due to particle porosity, IEEJ Trans. FM, 132, 2, pp. 136-141, (2012)