Comparative Study on High-Temperature Electrical Properties of 1.2 kV SiC MOSFET and JBS-Integrated MOSFET

被引:9
作者
Gu, Zhaoyuan [1 ]
Yang, Mingchao [1 ]
Yang, Yi [1 ]
Liu, Xihao [1 ]
Gao, Mingyang [1 ]
Qi, Jinwei [1 ]
Liu, Weihua [1 ]
Han, Chuanyu [1 ]
Geng, Li [1 ]
Hao, Yue [2 ]
机构
[1] Xi An Jiao Tong Univ, Sch Microelect, Dept Microelect, Xian 710049, Peoples R China
[2] Xidian Univ, Sch Microelect, Xian 710071, Peoples R China
基金
中国国家自然科学基金;
关键词
4H-SiC; high-temperature; JBS-integrated MOSFET; MOSFET; TRENCH MOSFET; POWER MOSFETS; SCHOTTKY DIODES; MODEL; PERFORMANCE; GATE; PIN;
D O I
10.1109/TPEL.2023.3338487
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
For 4H-SiC mosfets, the parasitic PiN body diode causes problems such as significant forward voltage drop of body diode and poor reverse recovery characteristics during high-temperature operation. A reasonable solution is a mosfet with an integrated Schottky barrier diode to deactivate the PiN body diode. Since SiC mosfets can operate at extremely high temperatures, the characterization of electrical parameters at high temperatures and changing with the temperature are very important for high power applications and system reliability. However, there is a lack of comparison and analysis of the two devices on electrical properties at ultrahigh temperatures. In this article, a 1.2 kV conventional mosfet and a mosfet integrated with a junction barrier Schottky diode (JBSFET) were fabricated with a consistent process flow. In the temperature range from 300 to 575 K, analytical models of the temperature-dependent electrical parameters of these two devices were established and compared, which were successfully verified by the measurements. These models can provide guidance for ultrahigh temperature applications of JBSFETs. Temperature-related expressions can also be used for junction temperature monitoring of temperature-sensitive electrical parameters. Experimental results show that JBSFET has better third quadrant conduction characteristics and higher temperature stability below 450 K, but loses obvious performance advantages at 575 K. So, the recommended operating temperature range of JBSFET is from 300 to 450 K. Finally, the continuous operation performance of the body diodes in buck converters is analyzed. The higher efficiency of buck converter based on JBSFET's body diode indicates its great application potential in compact converters, especially in the recommended temperature range.
引用
收藏
页码:4187 / 4201
页数:15
相关论文
共 113 条
[1]   Temperature Dependence of 55 nm Gate Oxide, 2.3 kV SiC Power JBSFETs With Linear, Hexagonal, and Octagonal Cell Layouts [J].
Agarwal, Aditi ;
Baliga, B. Jayant .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2022, 69 (03) :1233-1241
[2]   650-V 4H-SiC Planar Inversion-Channel Power JBSFETs With 55-nm Gate Oxide: Relative Performance of Three Cell Types [J].
Agarwal, Aditi ;
Han, Kijeong ;
Baliga, B. J. .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2021, 68 (05) :2395-2400
[3]   2.3 kV 4H-SiC Planar-Gate Accumulation Channel Power JBSFETs: Analysis of Experimental Data [J].
Agarwal, Aditi ;
Baliga, B. J. .
IEEE JOURNAL OF THE ELECTRON DEVICES SOCIETY, 2021, 9 (09) :324-333
[4]   Assessment of Linear, Hexagonal, and Octagonal Cell Topologies for 650 V 4H-SiC Inversion-Channel Planar-Gate Power JBSFETs Fabricated With 27 nm Gate Oxide Thickness [J].
Agarwal, Aditi ;
Han, Kijeong ;
Baliga, B. J. .
IEEE JOURNAL OF THE ELECTRON DEVICES SOCIETY, 2021, 9 :79-88
[5]   2.3 kV 4H-SiC Accumulation-channel JBSFETs: Experimental Comparison of Linear, Hexagonal and Octagonal Cell Topologies [J].
Agarwal, Aditi ;
Han, Kijeong ;
Baliga, B. Jayant .
2020 DEVICE RESEARCH CONFERENCE (DRC), 2020,
[6]   Demonstration of Superior Electrical Characteristics for 1.2 kV SiC Schottky Barrier Diode-Wall Integrated Trench MOSFET With Higher Schottky Barrier Height Metal [J].
Aiba, Ruito ;
Matsui, Kevin ;
Baba, Masakazu ;
Harada, Shinsuke ;
Yano, Hiroshi ;
Iwamuro, Noriyuki .
IEEE ELECTRON DEVICE LETTERS, 2020, 41 (12) :1810-1813
[7]  
Aiba R, 2019, PROC INT SYMP POWER, P23, DOI [10.1109/ispsd.2019.8757628, 10.1109/ISPSD.2019.8757628]
[8]   Design guidelines for SBD integration into SiC-MOSFET breaking RonA-diode conduction capability trade-off [J].
Asaba, Shunsuke ;
Furukawa, Masaru ;
Kusumoto, Yuji ;
Iijima, Ryosuke ;
Kono, Hiroshi .
2022 INTERNATIONAL ELECTRON DEVICES MEETING, IEDM, 2022,
[9]  
Baliga B. J., 2010, Fundamentals of power semiconductor devices
[10]  
Baliga B.J., 2006, SILICON CARBIDE POWE