Research progress of carbon-based fillers in polymer matrix insulating and thermally conductive composites

被引:0
作者
Tian K. [1 ]
Wu Y. [1 ]
Sheng S. [1 ]
Pan C. [1 ]
Cheng G. [1 ]
Ding G. [1 ]
机构
[1] School of Materials Science and Engineering, Anhui University of Science and Technology, Huainan
来源
Fuhe Cailiao Xuebao/Acta Materiae Compositae Sinica | 2021年 / 38卷 / 04期
关键词
Carbon-based fillers; Composites; Electrical insulation; Polymer matrix; Thermal conductivity;
D O I
10.13801/j.cnki.fhclxb.20201224.001
中图分类号
学科分类号
摘要
The high-quality development of the integrated circuit industry puts forward higher requirements for the insulation properties and thermal conductivity of supporting materials in its industrial chain. The basic research of carbon-based materials with excellent properties, such as high thermal conductivity, low density and active surface interface in polymer matrix composites, is essential for the performance improvement and application development of high-performance insulating and thermally conductive materials. This article systematically reviews the research progress of carbon-based fillers in polymer matrix insulating and thermally conductive composites. Firstly, the thermal conduction mechanism, insulation mechanism, and insulation and thermal conduction compatibility mechanism of polymer matrix composites were introduced. Secondly, the surface treatment, spatial structure and distribution control methods of carbon-based fillers were reviewed, and the control mechanism of insulation properties and thermal conductivity wass studied. Finally, the unresolved scientific problems, technical difficulties and future development directions in the research work of polymer matrix insulating and thermally conductive composites were summarized and prospected. Copyright ©2021 Acta Materiae Compositae Sinica. All rights reserved.
引用
收藏
页码:1054 / 1065
页数:11
相关论文
共 74 条
  • [1] MOORE A L, LI S., Emerging challenges and materials for thermal management of electronics, Materials Today, 17, 4, pp. 163-174, (2014)
  • [2] XU X F, CHEN J, ZHOU J, Et al., Thermal conductivity of polymers and their nanocomposites, Advanced Materials, 30, 17, (2018)
  • [3] KIM G H, LEE D, SHANKER A, Et al., High thermal con-ductivity in amorphous polymer blends by engineered interchain interactions, Nature Materials, 14, 3, pp. 295-300, (2015)
  • [4] CHEN X K, CHEN K Q., Thermal transport of carbon nanomaterials, Journal of Physics: Condensed Matter, 32, 15, (2019)
  • [5] KAMRAN U, HEO Y J, LEE J W, Et al., Functionalized carbon materials for electronic devices: A review, Micromachines (Basel), 10, 4, (2019)
  • [6] YANG S Q, LI W Z, BAI S B, Et al., Fabrication of morphologically controlled composites with high thermal con-ductivity and dielectric performance from aluminum nanoflake and recycled plastic package, ACS Applied Materials & Interfaces, 11, 3, pp. 3388-3399, (2019)
  • [7] GONG Y, ZHOU W Y, SUI X Z, Et al., Core-shell structured Al/PVDF nanocomposites with high dielectric permittivity but low loss and enhanced thermal conductivity, Polymer Engineering & Science, 59, 1, pp. 103-111, (2019)
  • [8] TAO P F, LIU W, WANG Y G., Fabrication of two-layer SiC nanowire cladding tube with high thermal conductivity, Journal of the European Ceramic Society, 40, 9, pp. 3399-3405, (2020)
  • [9] WU Y M, YE K, LIU Z D, Et al., Cotton candy-templated fabrication of three-dimensional ceramic pathway within polymer composite for enhanced thermal conductivity, ACS Applied Materials & Interfaces, 11, 47, pp. 44700-44707, (2019)
  • [10] CHEN J, HUANG X Y, SUN B, Et al., Highly thermally conductive yet electrically insulating polymer/boron nitride nanosheets nanocomposite films for improved thermal management capability, ACS Nano, 13, 1, pp. 337-345, (2019)