共 28 条
[1]
Ahn J.H., Kim H., Kim J.H., Et al., Evaporative cooling performance characteristics in ice thermal energy storage with direct contact discharging for food cold storage, Appl. Energy, 330, (2023)
[2]
Alizade M., Ahmadi-Danesh-Ashtiani H., Toghraie D., Experimental study on the effects of different phase change materials for increasing the cooling rate of industrial electronic systems by using a heat exchanger with the specific heat sink, J. Energy Storage, 55, (2022)
[3]
Arshad A., Ali H.M., Ali M., Et al., Thermal performance of phase change material (PCM) based pin-finned heat sinks for electronics devices: effect of pin thickness and PCM volume fraction, Appl. Therm. Eng., 112, pp. 143-155, (2017)
[4]
Campbell J.B., Tolbert L.M., Ayers C.W., Et al., Two-phase cooling method using the R134a refrigerant to cool power electronic devices, IEEE Trans. Ind. Appl., 43, 3, pp. 648-656, (2007)
[5]
Cheng Y.S., Loo B.P.Y., Vickerman R., High-speed rail networks, economic integration and regional specialisation in China and Europe, Travel Behav. Soc., 2, 1, pp. 1-14, (2015)
[6]
Choi U.M., Blaabjerg F., Lee K.B., Study and handling methods of power IGBT module failures in power electronic converter systems, IEEE Trans. Power Electr., 30, 5, pp. 2517-2533, (2015)
[7]
Gao B., Yang F., Chen M., Et al., Thermal lifetime estimation method of IGBT module considering solder fatigue damage feedback loop, Microelectr. Reliab., 82, pp. 51-61, (2018)
[8]
Guowei X., Rui M., Junjie Z., Et al., Thermal performance of an array condenser flat heat pipe for IGBT heat dissipation, Microelectr. Reliab., 104, (2020)
[9]
He W., Zhang J., Guo R., Et al., Performance analysis and structural optimization of a finned liquid-cooling radiator for chip heat dissipation, Appl. Energy, 327, (2022)
[10]
Hu J., Huang M., Liu Y., Et al., Transient junction temperature estimation of IGBT using improved thermal model, Microelectr. Reliab., pp. 88-90, (2018)