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- [5] Study on moisture-induced corrosion mechanism of copper wire bonding by thermodynamic calculation 2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2013, : 777 - 780
- [6] Moisture-induced delayed spallation and interfacial hydrogen embrittlement of alumina scales JOM, 2006, 58 : 29 - 35