Testing Technologies for Analog/Mixed-Signal Circuits in IoT Era

被引:0
作者
Kobayashi H. [1 ]
Kuwana A. [1 ]
Wei J. [1 ]
Tsukiji N. [1 ]
Zhao Y. [1 ]
机构
[1] Gunma University, 1-5-1, Tenjin-cho, Kiryu, Gunma
关键词
Analog circuit test; Built-in self-test; Built-out self-test; Design-for-test; Mixed-signal circuit test;
D O I
10.1541/ieejeiss.141.1
中图分类号
学科分类号
摘要
This paper reviews production testing issues for analog and mixed-signal SoC in IoT era for analog circuit designers, and also introduces research examples including authors’ group research results in this area. Notice that production testing and measurement/characterization for ICs are similar but different, and this paper introduces the former. For IoT systems and automotive applications, analog and mixed-signal circuit testing is very important to realize their reliability at low cost, and there are a lot of technology challenges. Their overview including future technology challenges is described. © 2021 The Institute of Electrical Engineers of Japan.
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页码:1 / 12
页数:11
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共 81 条
  • [1] Roberts G. W., Taenzler F., Burns M., An Introduction to Mixed-Signal IC Test and Measurement, (2011)
  • [2] Halder A., Chatterjee A., Low-Cost Alternate EVM Test for Wireless Receiver Systems, IEEE VLSI Test Symposium, (2005)
  • [3] Asami K., Shimura T., Kurihara T., Novel Estimation Method of EVM with Channel Correction for Linear Impairments in Multi-Standard RF Transceivers, IEEE VLSI Test Symposium, (2013)
  • [4] Iwasaki T., The Solution of Testing Milli-Meter-Wave ICs (76 to 81 GHz) Without Expensive Instruments, IEEE VLSI Test Symposium, (2020)
  • [5] Ince M., Yilmaz E., Jeong J. W., Winemberg L., Ozev S., Evaluation of Loop Transfer Function Based Dynamic Testing of LDOs, IEEE International Test Conference in Asia, (2017)
  • [6] Okawara H., Elegant Construction of SSC Implemented Signal by AWG and Organized Under-Sample of Wideband Signal, IEEE International Test Conference, Anaheim, CA, (2011)
  • [7] Ishida M., Ichiyama K., Watanabe D., Kawabata M., Okayasu T., Real-Time Method for 16 Gbps 4-PAM Signal Interface, IEEE International Test Conference, (2012)
  • [8] Zhu M., Li J., Wang W., Chen D., A Built-In Self-Test Method for MEMS Piezoresistive Sensor, IEEE European Test Conference, Tallinn, Estonia, (2020)
  • [9] Maxwell P., Test for Low Cost CMOS Image Sensors, IEEE European Test Symposium, (2005)
  • [10] Esen B., Coyette A., Xama N., Dobbelaere W., Vanhooren R., Non-intrusive Detection of Defects in Mixed-Signal Integrated Circuits Using Light Activation, IEEE International Test Conference, (2017)