Dynamic Thermal Mechanical Coupling Effect in Disc Grinding and Its Influence on Workpiece Material Removal Process

被引：0

作者：

Xiu S.-C. ^{[1
]}

Lu Y. ^{[1
]}

Sun C. ^{[1
]}

Li Q.-L. ^{[1
]}

机构：

[1] School of Mechanical Engineering & Automation, Northeastern University, Shenyang

来源：

Dongbei Daxue Xuebao/Journal of Northeastern University | 2021年 / 42卷 / 03期

关键词：

Disc grinding; Dynamic thermal mechanical coupling effect; Grinding force; Movement trajectory; Workpiece surface profile;

D O I：

10.12068/j.issn.1005-3026.2021.03.013

中图分类号：

学科分类号：

摘要：

A theoretical modeling method based on dynamic thermal mechanical coupling effect is proposed for the thermodynamic distribution characteristics of contact surfaces in disc grinding. Firstly, the mathematical model of movement trajectory of multiple abrasive grains is established. Then, the surface grinding force of the workpiece is modeled analytically based on the dynamic distribution characteristics of movement trajectory and the height of effective abrasive grains. Subsequently, the dynamic thermal mechanical coupling process on the workpiece surface is analyzed with the finite difference method (FDM) according to the grinding force. Lastly, the finite element method (FEM) and disc grinding experiment are applied to verify the rationality of the theoretical analysis respectively. The results show that the workpiece surface profile height is different due to the homogenization degree of the dynamic thermal mechanical coupling. The workpiece surface profile can be improved by reducing the speed of grinding wheels. © 2021, Editorial Department of Journal of Northeastern University. All right reserved.

引用

页码：389 / 394and400

共 11 条

[1]

Sun Cong, Li Qing-liang, Xiu Shi-chao, Et al., Workpieces' surface material removal mechanism of disc grinding, Journal of Northeastern University (Natural Science), 41, 3, pp. 393-398, (2020)

[2]

Chen Xin, Wang Dong, Liu Yu-fan, Influence of high speed grinding on surface integrity of 18CrNiMo7-6, Surface Technology, 47, 9, pp. 259-265, (2018)

[3]

Wang L, Hu Z, Fang C, Et al., Study on the double-sided grinding of sapphire substrates with the trajectory method, Precision Engineering, 51, pp. 308-318, (2017)

[4]

Yang Jin-shuang, Zhu Xiang-long, Research on uniformity of trajectory in planetary double-side lapping process, Mechanical Research and Application, 28, 6, pp. 41-43, (2015)

[5]

Sun J, Qin F, Chen P, Et al., A predictive model of grinding force in silicon wafer self-rotating grinding, International Journal of Machine Tools and Manufacture, 109, pp. 74-86, (2016)

[6]

Koshy P, Iwasald A, Elbestawl M., Surface generation with engineered diamond grinding wheels: insights from simulation, CIRP Annals, 52, 1, pp. 271-274, (2003)

[7]

Sun C, Liu Z, Lan D, Et al., Study on the influence of the grinding chatter on the workpiece's microstructure transformation, The International Journal of Advanced Manufacturing Technology, 96, 9, pp. 3861-3879, (2018)

[8]

Malkin S, Guo C., Grinding technology: theory and applications of machining with abrasives, International Journal of Machine Tools & Manufacture, 31, 3, pp. 435-436, (1991)

[9]

Zhang Z, Song Y, Xu C, Et al., A novel model for undeformed nanometer chips of soft-brittle HgCdTe films induced by ultrafine diamond grits, Scripta Materialia, 67, 2, pp. 197-200, (2012)

[10]

Sun C, Duan J, Lan D, Et al., Prediction about ground hardening layers distribution on grinding chatter by contact stiffness, Archives of Civil and Mechanical Engineering, 18, 4, pp. 1626-1642, (2018)

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