共 6 条
- [1] Assessment of a Cyclic Bending Test Method for Printed Flexible Supercapacitor 2022 IEEE INTERNATIONAL CONFERENCE ON FLEXIBLE AND PRINTABLE SENSORS AND SYSTEMS (IEEE FLEPS 2022), 2022,
- [2] Failure mechanism of TFT devices on flexible substrate by cyclic bending test 2016 7TH INTERNATIONAL CONFERENCE ON COMPUTER AIDED DESIGN FOR THIN-FILM TRANSISTOR TECHNOLOGIES (CAD-TFT), 2016, : 5 - 5
- [3] Pad Cratering Based Failure Criterion for the Life Prediction of Board Level Cyclic Bending Test 2017 IEEE 67TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2017), 2017, : 448 - 455
- [4] The Effect of Width and Thickness on Cyclic Bending Reliability of Screen-Printed Silver Traces on a Plastic Substrate IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2016, 6 (05): : 722 - 728
- [5] Development of full-reversed bending fatigue tester based on AFM technique for cyclic damage evaluation of MEMS ADVANCES IN FRACTURE AND STRENGTH, PTS 1- 4, 2005, 297-300 : 567 - 573
- [6] Reliability and failure analysis of lead-free solder joints for PBGA package under a cyclic bending load IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2008, 31 (02): : 478 - 484