Experimental investigation of microchannel heat sink performance under non-uniform heat load conditions with different flow configurations

Cooling methods for multiple hotspots with high heat flux pose a reliability threat to electronic devices. This study investigates the microchannel-based heat sink performance under various non-uniform heat load conditions for different geometry with three different flow configurations (I, U and Z). An in-house designed Heater Array Unit (HAU) facilitates the generation of both uniform and non-uniform heat loads using a heater power supply. Two different microchannel geometries were employed, namely, microchannel-1 (MC-1) with channel and fin widths of 0.6 mm and 0.33 mm, respectively, and MC-2 with dimensions of 0.64 mm and 0.572 mm. Each microchannel incorporates three manifold configurations (I, U, and Z). Each flow configuration is regulated by flow control valves. Various non-uniform heat load patterns were considered, including streamline, non-streamline, and across-streamline conditions. To assess the thermal performance of the heat sinks the parameters used are thermal resistance (R-th), Nusselt number (Nu), and temperature non-uniformity (psi). Experimental findings indicate that the MC-2 design with an I flow configuration is more suitable for uniform heat load conditions. On the contrary, for some non-uniform heat load cases MC-1 also showed up as a suitable design over MC-2.