Performance Improvement of Z-Type Manifold Microchannel Heat Sink with Novel Fin-Arrangements

被引:6
作者
Chen, Boqian [1 ,3 ]
Zhang, Chunyu [2 ]
Xu, Yiqin [1 ]
Chen, Zhitao [1 ]
机构
[1] Guangdong Acad Sci, Inst Semicond, Guangzhou, Peoples R China
[2] Univ Sci & Technol China, Dept Modern Mech, Hefei, Peoples R China
[3] Guangdong Acad Sci, Inst Semicond, Guangzhou 510650, Guangdong, Peoples R China
关键词
FLOW; ENHANCEMENT;
D O I
10.1080/01457632.2024.2337972
中图分类号
O414.1 [热力学];
学科分类号
摘要
The Z-type manifold microchannel heat sinks are mostly used by researchers due to the simple structure and considerable heat transfer performance. In this study, a novel Z-type manifold microchannel heat sink with fins arranged at intervals in an arithmetic sequence is proposed to improve the thermo-hydraulic performance of the conventional Z-type manifold microchannel. The novel feature of the proposed design is the channel widths being in an arithmetic sequence with a negative common difference, which contributes to equalize the flow distribution among the channels. Various fin arrangements with different common differences under the same heat transfer area are numerically investigated to determine the thermo-hydraulic performance. The results show that the fins arranged at intervals in an arithmetic sequence have a great potential in mitigating the flow maldistribution. Compared to the conventional manifold microchannel, the proposed manifold microchannel has better thermal performance without a significant increase in pressure drop.
引用
收藏
页码:661 / 676
页数:16
相关论文
共 36 条
[11]  
Harpole G.M., 1991, Proc. 7th IEEE Semi-Therm. Symp, P59, DOI [DOI 10.1109/STHERM.1991.152913, 10.1109/STHERM.1991.152913]
[12]   A uniform temperature heat sink for cooling of electronic devices [J].
Hetsroni, G ;
Mosyak, A ;
Segal, Z ;
Ziskind, G .
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2002, 45 (16) :3275-3286
[13]   Heat transfer enhancement on a microchannel heat sink with impinging jets and dimples [J].
Huang, Xiaoming ;
Yang, Wei ;
Ming, Tingzhen ;
Shen, Wenqing ;
Yu, Xiangfei .
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2017, 112 :113-124
[14]   Embedded cooling with 3D manifold for vehicle power electronics application: Single-phase thermal-fluid performance [J].
Jung, Ki Wook ;
Kharangate, Chirag R. ;
Lee, Hyoungsoon ;
Palko, James ;
Zhou, Feng ;
Asheghi, Mehdi ;
Dede, Ercan M. ;
Goodson, Kenneth E. .
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2019, 130 :1108-1119
[15]   Evaluation of single phase flow in microchannels for high heat flux chip cooling - Thermohydraulic performance enhancement and fabrication technology [J].
Kandlikar, SG ;
Grande, WJ .
HEAT TRANSFER ENGINEERING, 2004, 25 (08) :5-16
[16]   A New Approach for the Mitigating of Flow Maldistribution in Parallel Microchannel Heat Sink [J].
Kumar, Ritunesh ;
Singh, Gurjeet ;
Mikielewicz, Dariusz .
JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME, 2018, 140 (07)
[17]  
Kundu P.K., 2012, FLUID MECH-SOV RES
[18]   Single-phase and Two-phase Flow and Heat Transfer in Microchannel Heat Sink with Various Manifold Arrangements [J].
Lin, Yuhao ;
Luo, Yang ;
Li, Wei ;
Cao, Yanlong ;
Tao, Zhi ;
Shih, Tom I-P .
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2021, 171
[19]   Effect of manifold flow configuration on two-phase ultra-high flux cooling [J].
Mandel, Raphael ;
Shooshtari, Amir ;
Ohadi, Michael .
NUMERICAL HEAT TRANSFER PART A-APPLICATIONS, 2018, 74 (08) :1425-1442
[20]   Experimental Characterization of Additively Manufactured Metallic Heat Exchangers [J].
Mortazavi, Mehdi ;
Niknam, Seyed A. ;
Heidari, Mahbod ;
Clemente, Riccardo C. .
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2021, 11 (12) :2089-2101