Effect of grain boundary on scratch behavior of polycrystalline copper

The anisotropy in the elastoplastic response of crystalline solids influences substantially their scratch resistance at the microscale. While grain boundaries typically act as obstacles to the motion of dislocations at the grain level, the scratch behavior in the vicinity of the grain boundary is influenced by other factors such as crystallographic orientation and pile-up topography. We performed a systematic set of nano-scratch simulations using the mechanism-based strain gradient crystal plasticity to study the evolution of scratch force and depth near grain boundaries. To validate our model, we conducted a nano-scratch test on a polycrystalline copper sample and compared the scratch depth profile for a specific grain boundary with the simulated result, where a good qualitative agreement was achieved. Our simulations showed that the scratch depth, force, and hardness vary between the corresponding values for the individual constitutive grains, and the variation decreases by reducing the grain size. Additionally, we analyzed the scratch response in terms of the pile-up topography and subsurface stresses and distinguished different regimes when the indenter approaches and scratches across the boundary. Our findings offer a new direction to optimize the scratch resistance of polycrystalline metals by tailoring the size and orientation of grains near the surface. Additionally, it introduces scratching as a robust material characterization method.