Thermal simulation of micro hotplate for multiple MEMS gas sensors

被引：0

作者：

YANG G. ^{[1
]}

ZHANG Z. ^{[1
]}

ZHANG Y.-L. ^{[1
]}

LUO Y.-Y. ^{[2
,3
]}

XIONG X. ^{[1
]}

DUAN G.-T. ^{[1
]}

机构：

[1] Wuhan National Laboratory for Optoelectronics, School of Optical and Electronic Information, Huazhong University of Science and Technology, Wuhan

[2] Key Lab of Materials Physics, Anhui Key Lab of Nanomaterials and Nanotechnology, Institute of Solid State Physics, HFIPS, Chinese Academy of Sciences, Hefei

[3] University of Science and Technology of China, Hefei

来源：

Chinese Journal of Analytical Chemistry | 2022年 / 50卷 / 01期

关键词：

Finite element analysis; Gas sensor; MEMS; Micro hotplate; Temperature distribution;

D O I：

10.1016/j.cjac.2021.11.001

中图分类号：

学科分类号：

摘要：

With the development of MEMS technologies, research on MEMS gas sensor has emerged recently, and micro hotplate (MHP) is designed to provide suitable temperature for MEMS gas sensor. Heat properties of MHP profoundly influence the sensing properties of MEMS gas sensor. With the tendency of down-sizing in MEMS gas sensors, traditional temperature measurements such as contact measure and infrared temperature detection are no longer available due to relatively low resolution. In this work we used finite element analysis (FEA) to realize cost- and time-saving heat property evaluations for MEMS gas sensor with different MHP structures, and two indexes were introduced to describe heat properties of MHPs, such as area factor Q to describe area of isotherm and roundness of isotherm %R to evaluate isotherm shape. It is found that silicon oxide and silicon nitride suspension structures have different tendency in heat properties. The size of working area has important impacts on the heat properties of the MHP, and MHP with different working area may be applied in different applications. For instance, larger MHP with 1643 μm2/K area factor Q is suitable for noble metal catalytic gas sensing application, which requires uniform temperature distribution, and smaller MHP, which could reach 609 °C peak temperature at 30 mW power-consumption, is applied to IoT applications with battery power supply. Furthermore, some special characteristics of the heat distribution of MHP are found with adjusting the width of suspension beams. This work provides guidance on how to design proper sensing material shapes to utilize the performance of MHP and reduce heat loss. © 2021

引用

页码：38 / 43

页数：5

共 22 条

[1]

Zhou Q., Sussman A., Chang J.Y., Dong J., Zettl A., Mickelson W., Sens Actuators, A, 223, pp. 67-75, (2015)

[2]

Chen M.Q., Peng S.F., Wang N.C., Xu L., Lin F.J., Wu F., IEEE Sens J, 19, pp. 3130-3137, (2019)

[3]

Kwak S.M., Shim Y.S., Yoo K.Y., Lee J.H., Kim I., Kim J., Lee K.H., Lee J.H., Electron Mater Lett, 14, pp. 305-313, (2018)

[4]

Wang Y., Tong W.G., Han N., Mater Lett, 273, (2020)

[5]

Wang B., Dong X.S., Wang Z., Wang Y.F., Hou Z.Y., ACS Sens, 5, pp. 994-1001, (2020)

[6]

Shen W.C., Shih P.J., Tsai Y.C., Hsu C.C., Dai C.L., Micromachines, 11, (2020)

[7]

Suh J.H., Cho I., Kang K., Kweon S.J., Lee M., Yoo H.J., Park I., Sens Actuators, B, 265, pp. 660-667, (2018)

[8]

Yuan K.P., Wang C.Y., Zhu L.Y., Cao Q., Yang J.H., Li X.X., Huang W., Wang Y.Y., Lu H.L., Zhang W., ACS Appl Mater Interfaces, 12, pp. 14095-14104, (2020)

[9]

Li Q.C., Chen D., Miao J.M., Lin S.J., Yu Z.X., Han Y.T., Yang Z., Zhi X., Cui D.X., An Z.H., ACS Appl Mater Interfaces, 12, pp. 25243-25252, (2020)

[10]

Hsueh T.J., Peng C.H., Chen W.S., Sens Actuators, B, 304, (2020)

← 1 2 3 →