Influence of tool flank wear considering tool edge radius on instantaneous uncut chip thickness and cutting force in micro-end milling

Accurate theoretical analysis and modeling of instantaneous uncut chip thickness (IUCT) play a crucial role in the cutting force prediction of the micro-milling process. Tool wear and tool runout have a significant influence on the IUCT and become key factors to be considered. An IUCT model covering the influence of tool runout and tool flank wear considering tool edge radius is proposed. Based on this the prediction model of the cutting force is constructed in the micro-end milling process. Firstly, an actual tool radius model considering tool flank wear and tool edge radius is analyzed. The IUCT model is established by constructing the trochoidal trajectories of the current cutting edge and all cutting edges in the previous cycle considering tool flank wear and tool runout. Moreover, tool flank wear and tool runout are considered in the determination of cutter-workpiece engagement and the calibration of cutting force coefficients. Effectiveness of the established cutting force model is verified by micro milling experiments and statistical analysis. Results show that tool flank wear has a significant effect on the cutting forces of the three directions, and the influence of tool flank wear on the IUCT is small in a certain range. This work for predicting the IUCT and cutting force sheds new light on revealing various derived physical phenomena such as deformation, heat, and stress in the micro-cutting process. The instantaneous uncut chip thickness model covering the influence of tool runout and tool flank wear considering tool edge radius is proposed.The micro-milling cutting force based on instantaneous uncut chip thickness is predicted from the mechanism level.Effectiveness of the established cutting force model is verified by micro-milling experiments and statistic analysis.The influence of tool flank wear on the instantaneous uncut chip thickness and cutting force is analyzed.