Thermo-Mechanical Co-Design of Double Sided Cooling Power Module for Electric Vehicle Application

被引:0
作者
Zeng Z. [1 ]
Ou K. [1 ]
Wu Y. [2 ]
Ke H. [2 ]
Zhang X. [3 ]
机构
[1] State Key Laboratory of Power Transmission Equipment & System Security and New Technology, Chongqing University, Chongqing
[2] State Key Laboratory of Advanced Power Semiconductor Devices, CRRC Times Semiconductor Co. Ltd, Zhuzhou
[3] School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore
来源
Diangong Jishu Xuebao/Transactions of China Electrotechnical Society | 2020年 / 35卷 / 14期
关键词
Double-sided cooling; Multi-objective optimization; Power module; Thermal-mechanical co-design;
D O I
10.19595/j.cnki.1000-6753.tces.190765
中图分类号
学科分类号
摘要
The double-sided cooling (DSC) packaging remarkably reduces the junction-case thermal resistance and interconnection electrical parasitic of the power module, which is recommended as the foundation of next-generation power control unit of the electric vehicle. However, some technical obstacles should be addressed for the emerging DSC power module. As far as now, the thermo-mechanical interaction mechanism in the DSC power module is not clear. Besides, the multi-physics-oriented co-design methodology of the DSC power module is not available. In this paper, to overcome the tradeoff between thermal resistance and mechanical stress, a multi-objective co-design method is proposed for the DSC power module. The mathematical models are proposed to characterize the thermal and mechanical properties of the DSC power module. In addition, how the material properties and packaging sizes influence the specifications of the DSC power module is insightfully investigated. The finite element analysis (FEA) simulation tool is employed to confirm the proposed models. Besides, a multi-objective optimization model is proposed to coordinately improve the thermo-mechanical performances of the DSC power module, and it is solved by the non-dominated sorting genetic algorithm II (NSGA-II). Finally, based on the proposed multi-objective co-design method, the influence of packaging materials on the optimization results is comparably investigated. © 2020, Electrical Technology Press Co. Ltd. All right reserved.
引用
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页码:3050 / 3064
页数:14
相关论文
共 45 条
  • [1] Wang Xuemei, Researches and applications of wide bandgap SiC power devices in electric vehicles, Proceedings of the CSEE, 34, 3, pp. 371-379, (2014)
  • [2] Developpement Yole, EV-HEV market and techno-logy trends [EB/OL], (2015)
  • [3] Hirschmann D, Tissen D, Schroder S, Et al., Reliability prediction for inverters in hybrid elec-trical vehicles, IEEE Transactions on Power Electronics, 22, 6, pp. 2511-2517, (2007)
  • [4] Seal S, Mantooth H A., High performance silicon carbide power packaging-past trends, present prac-tices, and future directions, Energies, 10, 3, pp. 1-30, (2017)
  • [5] Wang Lina, Deng Jie, Yang Junyi, Et al., Junction temperature extraction methods for Si and SiC power devices-a review and possible alternatives, Transactions of China Electrotechnical Society, 34, 4, pp. 703-716, (2019)
  • [6] Wang Xiaoyuan, Du Jingjuan, CFD analysis of heat transfer characterization in spiral channel cooling for permanent magnet electric machine in EVs, Transactions of China Electrotechnical Society, 33, 4, pp. 955-963, (2018)
  • [7] Zhang Hui, Ang S S, Mantooth H A, Et al., A high temperature, double-sided cooling SiC power electro-nics module, 2013 IEEE Energy Conversion Con-gress and Exposition, pp. 2877-2883, (2013)
  • [8] Zhu Nan, Mantooth H A, Xu Dehong, Et al., A solution to press-pack packaging of SiC MOSFETs, IEEE Transactions on Industrial Electronics, 64, 10, pp. 8224-8234, (2017)
  • [9] Gonzalez J O, Alatise O, Aliyu A M, Et al., Evaluation of SiC schottky diodes using pressure contacts, IEEE Transactions on Industrial Electronics, 64, 10, pp. 8213-8223, (2017)
  • [10] Kicin S, Laitinen M, Haederli C, Et al., Low-voltage AC drive based on double-sided cooled IGBT press-pack modules, IEEE Transactions on Industry Applications, 48, 6, pp. 2140-2146, (2012)