The influences of Ag nanoparticles on voids growth and solderability about Sn3.0Ag0.5Cu/Cu solder joint

被引:2
作者
Zhao, Lingyan [1 ,2 ]
Bai, Hailong [1 ,2 ]
Gu, Xin [3 ]
Liang, Huaxin [2 ]
Yang, Hongwei [1 ]
Yan, Jikang [4 ]
机构
[1] Kunming Univ Sci & Technol, Fac Met & Energy Engn, Kunming 650093, Peoples R China
[2] Yunnan Tin Grp Holding Co Ltd, R&D Ctr, Kunming 650106, Peoples R China
[3] Kunming Univ Sci & Technol, Fac Mat Sci & Engn Kunming, Kunming 650093, Peoples R China
[4] Southwest Petr Univ, Sch Engn, Nanchong 637001, Peoples R China
关键词
Sn3.0Ag0.5Cu; Ag nanoparticles; solderability; voids growth; CREEP RESISTANCE; MICROSTRUCTURE; EVOLUTION; ALLOY;
D O I
10.1088/2053-1591/ad4197
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Although Sn3.0Ag0.5Cu solder (SAC305) has higher reliability, there are a large number of harmful voids in solder joints. Larger voids can reduce thermal conductivity of solder joints. However, as a microstructure growth inhibitor, the influences of Ag nanoparticles on voids growth are not clear at present. Herein, we prove that Ag nanoparticles can increase SAC305 solderability, but promote voids growth. Ag nanoparticles and SAC305 solder paste were mixed by mechanical stirring for 0.5 h. Next, SAC305-xAgP (x = 0, 0.1, 0.2, 0.3, 0.4 and 0.5 wt%) was obtained. The results indicated that solder solderability was improved increasingly with Ag nanoparticles addition. The lower the amount of nanoparticles added, the greater the final loss. After being aged at 100 degrees C for 150 h, the voids stopped growing. Due to the violent reaction between Ag nanoparticles and flux, the final voids growth rate became faster, and the average voids size changed from 14.34% to 24.91%.
引用
收藏
页数:7
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