Effect of Different Substrates on Plasma Jet Discharge Characteristics and Thin Film Properties

被引：0

作者：

Wang R. ^{[1
]}

Zhang P. ^{[1
,2
]}

Xu H. ^{[1
,2
]}

Zhang C. ^{[1
]}

Li T. ^{[3
]}

Shao T. ^{[1
]}

机构：

[1] Key Laboratory of Power Electronics and Electric Drive, Institute of Electrical Engineering, Chinese Academy of Sciences, Beijing

[2] School of Electrical Engineering, Zhengzhou University, Zhengzhou

[3] School of Energy and Power Engineering, Beihang University, Beijing

来源：

Gaodianya Jishu/High Voltage Engineering | 2019年 / 45卷 / 05期

基金：

中国国家自然科学基金;

关键词：

Different substrates; OH distribution; Plasma jet; Plasma jet development process; Thin film properties;

D O I：

10.13336/j.1003-6520.hve.20190430002

中图分类号：

学科分类号：

摘要：

Materials surface modification by plasma involves plasma-substrates interaction. The existence of insulation or metal substrate will change the plasma discharge and chemical vapor deposition process. Consequently, we investigated the influences of different substrates (insulation or metal) on the distribution of active particles and ground state OH, and established a relationship between plasma jet discharge process and film characteristics. The results show that the plasma jet exhibits different characteristics near the substrate during film deposition. The optical emission of Ar, N2 and OH with a higher intensity is observed on the PMMA substrate. The OH free redical mainly distributes near the nozzle when the substrate is PMMA, and distributes in the whole space area between the nozzle and the substrate when the substrate is Cu The increase of TEOS content leads to the increase of the number of intermediate products formed by the decomposition of TEOS, which in turn increases the deposition rate of the films. In addition, the field intensity near the substrate varies with different materials. For example, the field intensity near the PMMA substrate remains basically unchanged while near the Cu substrate it increases. By analyzing and comparing the composition of the films, it is found that the films deposited on PMMA surface have higher oxidation degree and less impurities. Furthermore, by comparing and diagnosing the deposition process of thin films on different substrates, it is of great significance to understand and solve the problems in engineering applications. © 2019, High Voltage Engineering Editorial Department of CEPRI. All right reserved.

引用

页码：1360 / 1366

页数：6

共 25 条

[1] Kasih T.P., Kuroda S., Kubota H., Atmospheric pressureargon plasma torch for deposition of thin silicon dioxide films, Chemical Vapor Deposition, 13, 4, pp. 169-175, (2007)
[2] Fang X., Hu W., Dong D., Research progress in cracking of porous silica films prepared by sol-gel process, Materials Review, 22, pp. 18-20, (2008)
[3] Jiang Y., Bao Y., Chen B., Progress for surface treatment of plasma electrolysis on materials, High Voltage Apparatus, 53, 4, pp. 41-44, (2017)
[4] Cheng X., Xu H., Wang R., Et al., Composite thin film deposited by plasma to inhibit the lifting of metal particles, Transactions of China Electrotechnical Society, 33, 20, pp. 4672-4681, (2018)
[5] Ma Y., Zhang C., Kong F., Et al., Effect of plasma jet array assisted film deposition on epoxy resin surface electrical characteristics, High Voltage Engineering, 44, 9, pp. 3089-3096, (2018)
[6] Fang Z., Zhang B., Zhou R., Et al., Effect of HMDSO addition on discharge characteristics of atmospheric pressure plasma jet array in argon, High Voltage Engineering, 43, 6, pp. 1775-1783, (2017)
[7] Long C., Wang L., Dai H., Et al., Effect of dielectric barrier discharge on hydrophobicity of RTV coatings, High Voltage Engineering, 44, 2, pp. 568-574, (2018)
[8] Shao T., Zhang C., Wang R., Et al., Atmospheric-pressure pulsed gas discharge and pulsed plasma application, High Voltage Engineering, 42, 3, pp. 685-705, (2016)
[9] Dai D., Ning W., Shao T., A review on the state of art and future trends of atmospheric pressure low temperature plasmas, Transactions of China Electrotechnical Society, 32, 20, pp. 1-9, (2017)
[10] Sang L., Wang M., Chen Q., Et al., Barrier properties of SiO<sub>x</sub> coatings desposited on polyelene films, China Surface Engineering, 28, 3, pp. 36-41, (2015)

← 1 2 3 →