The curing characteristics and properties of bisphenol A epoxy resin/maleopimaric acid curing system

被引:1
|
作者
Liu, Hechen [1 ]
Wu, Xuan [1 ]
Liu, Yunpeng [1 ]
Guo, Zhanpeng [1 ]
Ge, Qi [1 ]
Sun, Zhanglin [1 ]
机构
[1] Department of Electrical Engineering, North China Electric Power University, Baoding, China
基金
中国国家自然科学基金;
关键词
Epoxy resins;
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
页码:1655 / 1665
相关论文
共 50 条
  • [1] The curing characteristics and properties of bisphenol A epoxy resin/maleopimaric acid curing system
    Liu, Hechen
    Wu, Xuan
    Liu, Yunpeng
    Guo, Zhanpeng
    Ge, Qi
    Sun, Zhanglin
    JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, 2022, 21 : 1655 - 1665
  • [2] Electrical Tree Characteristics of Bisphenol A Epoxy Resin/Maleopimaric Anhydride Curing System
    Liu, Hechen
    Wu, Xuan
    Guo, Zhanpeng
    Dong, Peng
    Ge, Qi
    Wei, Liwei
    Sun, Zhanglin
    POLYMERS, 2022, 14 (18)
  • [3] Curing characteristics of bisphenol A epoxy resin system under electron beam action
    Sui, G
    Zhang, ZG
    Zhong, WH
    Li, FM
    ACTA POLYMERICA SINICA, 2001, (05) : 674 - 677
  • [4] Study on curing kinetics of a diglycidyl ether of bisphenol A epoxy resin/microencapsulated curing agent system
    Wang Fang
    Xiao Jun
    Wang Jing-wen
    Li Shu-qin
    HIGH PERFORMANCE POLYMERS, 2012, 24 (08) : 730 - 737
  • [5] Renewable green reactive diluent for bisphenol a epoxy resin system: curing kinetics and properties
    Li, Jingyu
    Zhao, Haichao
    Sui, Guoxin
    RSC ADVANCES, 2022, 12 (49) : 31699 - 31710
  • [6] UV-curing process and mechanical properties of bisphenol a epoxy resin
    Liu, Bo
    Li, Yong
    Xiao, Jun
    Chen, Yunlei
    Xiao, Jian
    Hangkong Xuebao/Acta Aeronautica et Astronautica Sinica, 2014, 35 (05): : 1424 - 1432
  • [7] Preparation, curing kinetics, and thermal properties of bisphenol fluorene epoxy resin
    Dai, Zhen
    Li, Yanfang
    Yang, Shuguang
    Zong, Chengzhong
    Lu, Xukui
    Xu, Jian
    Journal of Applied Polymer Science, 2007, 106 (03): : 1476 - 1481
  • [8] Preparation, curing kinetics, and thermal properties of bisphenol fluorene epoxy resin
    Dai, Zhen
    Li, Yanfang
    Yang, Shuguang
    Zong, Chengzhong
    Lu, Xukui
    Xu, Jian
    JOURNAL OF APPLIED POLYMER SCIENCE, 2007, 106 (03) : 1476 - 1481
  • [9] Crystal Structure, Curing Kinetics, and Thermal Properties of Bisphenol Fluorene Epoxy Resin
    Xiong, Yuanqin
    Liu, Hanping
    Ou, Encai
    Zeng, Xiaoliang
    Zhou, Wei
    Xu, Weijian
    JOURNAL OF APPLIED POLYMER SCIENCE, 2010, 118 (02) : 827 - 833
  • [10] Curing properties of novel curing agent based on phenyl bisthiourea for an epoxy resin system
    Ramesh, P.
    Ravikumar, L.
    Burkanudeen, A.
    JOURNAL OF THERMAL ANALYSIS AND CALORIMETRY, 2014, 115 (01) : 713 - 722