Investigation on machining performance of soft-brittle KDP crystals with surface micro-defects in the ball-end milling repairing process

被引:14
作者
Lei, Hongqin [1 ,2 ]
Zhao, Linjie [2 ]
Cheng, Jian [1 ,2 ]
Chen, Mingjun [1 ,2 ]
Liu, Qi [3 ]
Wang, Jinghe [2 ]
Yang, Dinghuai [2 ]
Ding, Wenyu [2 ]
Chen, Guang [2 ]
Han, Chengshun [2 ]
机构
[1] Harbin Inst Technol, State Key Lab Robot & Syst, Harbin 150001, Peoples R China
[2] Harbin Inst Technol, Sch Mechatron Engn, Harbin 150001, Peoples R China
[3] Univ Strathclyde, Ctr Precis Mfg, DMEM, Glasgow G1 1XJ, Scotland
基金
中国国家自然科学基金;
关键词
KDP crystal; Machining performance; Ball -end milling; Surface micro -defect; DUCTILE TRANSITION; MECHANISM; SIMULATIONS; QUALITY; SILICON;
D O I
10.1016/j.susmat.2024.e00884
中图分类号
X [环境科学、安全科学];
学科分类号
08 ; 0830 ;
摘要
Micro ball -end milling technology is an excellent repair strategy for economically removing surface micro -defects of large-scale KDP optics in the high -power laser devices. However, it is an urgent challenge for defective KDP crystals to achieve ultra -smooth repaired surface in ductile mode cutting, because pre-existing surface defects with different geometry and dimensions can affect machining performance during the reparative process by changing the uncut chip thickness (UCT). Therefore, the influence of various surface micro -defects on the machining performance is systematically investigated from the perspectives of the UCT, tensile stress, cutting force, and surface quality in this work. Interestingly, the plastic scratches and fracture pits could transform the brittle mode cutting into a ductile removal process by increasing the UCT, showing a decrease in the brittle fractures, the maximum tensile stress and the fluctuation of cutting force, indicating that the ductile removal ability can be improved. While, the effect of the surface protuberances on the repair quality is opposite. Besides, although the convex scratches and the cracks could cause a slight increase in the UCT, it has almost no impact effect on the material removal mode. More interestingly, for the fracture pits with specific dimensions, when it is not completely removed, the growth behavior of defect dimensions occurs during the reparative process due to the action of mechanical forces, reducing the surface quality. Consequently, the above work provides significant theoretical importance and engineering application value to formulate corresponding repair strategies for various surface defects to obtain the ultra -smooth surface of optical components.
引用
收藏
页数:17
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