Design and Performance Analysis of High-k Gate All Around Fin-field Effect Transistor

被引:10
|
作者
Rohith, K. [1 ]
Sravani, K. Girija [1 ]
Rao, K. Srinivasa [1 ]
Balaji, B. [1 ]
Agarwal, V. [1 ]
机构
[1] Koneru Lakshmaiah Educ Fdn, Dept Elect & Commun Engn, Vaddeswaram, Andhra Pradesh, India
来源
INTERNATIONAL JOURNAL OF ENGINEERING | 2024年 / 37卷 / 03期
关键词
Silicon Dioxide; Gate Engineering; Drain Current; Fin Shape; Symmetric; JUNCTIONLESS FINFET; ACCUMULATION-MODE;
D O I
10.5829/ije.2024.37.03c.04
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
This paper introduces and investigates a symmetrical structural design centered around a Nanoscale Fin Field-Effect Transistor (Fin-FET). Employing advanced tcad simulation techniques, the study discusses the characteristics of the Fin-FET. Here, a comprehensive exploration of the device performance across a spectrum of parameters, including drain current, electric field distribution, surface potential variations, energy band configurations, carrier concentration behaviors, and the Ion/Ioff ratio. Through rigorous analysis, the research sheds light on the symmetrical design's impact on these fundamental aspects of the Fin-FET's operation. The insights gained from this study hold the potential to enhance our understanding of device behavior, paving the road for refined designs and optimized utilization of Fin-FET technology in advanced semiconductor applications. Several types of engineering's are applied to test the device under various aspects. Gate engineering, doping engineering, and work function engineering were applied to test the device drain current characteristics. Therefore, this proposed has been widely adopted in modern Nano scale semiconductor devices.
引用
收藏
页码:476 / 483
页数:8
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