Dynamic anti-plane analysis for two symmetrically interfacial cracks near circular cavity in piezoelectric bi-materials

被引：0

作者：

AHASSAN ^{[1
]}

宋天舒 ^{[2
]}

机构：

[1] Department of Civil Engineering, Military Technical College

[2] College of Aerospace and Civil Engineering, Harbin Engineering University

来源：

Applied Mathematics and Mechanics(English Edition) | 2014年 / 35卷 / 10期

关键词：

symmetrically interfacial crack; piezoelectric bi-material; Green’s function; dynamic stress intensity factor(DSIF); dynamic anti-plane shearing wave(SH-wave);

D O I：

暂无

中图分类号：

O346.1 [断裂理论];

学科分类号：

080102 ;

摘要：

The present paper is exposed theoretically to the influence on the dynamic stress intensity factor(DSIF) in the piezoelectric bi-materials model with two symmetrically permeable interfacial cracks near the edges of a circular cavity, subjected to the dynamic incident anti-plane shearing wave(SH-wave). An available theoretical method to dynamic analysis in the related research field is provided. The formulations are based on Green's function method. The DSIFs at the inner and outer tips of the left crack are obtained by solving the boundary value problems with the conjunction and cracksimulation technique. The numerical results are obtained by the FORTRAN language program and plotted to show the influence of the variations of the physical parameters,the structural geometry, and the wave frequencies of incident wave on the dimensionless DSIFs. Comparisons with previous work and between the inner and outer tips are concluded.

引用

页码：1261 / 1270

页数：10

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