Planarization properties of an alkaline slurry without an inhibitor on copper patterned wafer CMP附视频

被引:0
|
作者
王辰伟 [1 ]
刘玉岭 [1 ]
田建颖 [2 ]
牛新环 [1 ]
郑伟艳 [1 ]
岳红维 [1 ]
机构
[1] Institute of Microelectronics,Hebei University of Technology
[2] Market Information Department of CSPC Zhongqi Pharmaceutical Technology(Shijiazhuang)
关键词
D O I
暂无
中图分类号
TN305.2 [表面处理];
学科分类号
摘要
<正>The chemical mechanical polishing/planarization(CMP) performance of an inhibitor-free alkaline copper slurry is investigated.The results of the Cu dissolution rate(DR) and the polish rate(PR) show that the alkaline slurry without inhibitors has a relatively high copper removal rate and considerable dissolution rate.Although the slurry with inhibitors has a somewhat low DR,the copper removal rate was significantly reduced due to the addition of inhibitors(Benzotriazole,BTA).The results obtained from pattern wafers show that the alkaline slurry without inhibitors has a better planarization efficacy;it can planarize the uneven patterned surface during the excess copper removal.These results indicate that the proposed inhibitor-free copper slurry has a considerable planarization capability for CMP of Cu pattern wafers,it can be applied in the first step of Cu CMP for copper bulk removal.
引用
收藏
页码:134 / 138
页数:5
相关论文
共 5 条
  • [1] Effect of organic additives on copper dissolution for e-CMP[J] P. Cojocaru;F. Muscolino;L. Magagnin Microelectronic Engineering 2010,
  • [2] Chemical mechanical planarization of copper in alkaline slurry with uric acid as inhibitor[J] Y. Nagendra Prasad;S. Ramanathan Electrochimica Acta 2007,
  • [3] Chemical mechanical planarization for microelectronics applications[J] Parshuram B. Zantye;Ashok Kumar;A.K. Sikder Materials Science & Engineering R 2004,
  • [4] Impact of different slurry and polishing pad choices on the planarization efficiency of a copper CMP process[J] Viet H. Nguyen;Roel Daamen;Romano Hoofman Microelectronic Engineering 2004,
  • [5] Potassium sorbate as an inhibitor in copper chemical mechanical planarization slurries.Part II:effects of sorbate on chemical mechanical planarization performance Nagar M;Vaes J;Eli Y E; Electrochimica Acta 2010,