ELECTROMIGRATION IN THIN SILVER, COPPER, GOLD, INDIUM, TIN, LEAD AND MAGNESIUM FILMS

被引：58

作者：

BREITLING, HM

HUMMEL, RE

机构：

来源：

JOURNAL OF PHYSICS AND CHEMISTRY OF SOLIDS | 1972年 / 33卷 / 04期

关键词：

D O I：

10.1016/S0022-3697(72)80101-X

中图分类号：

O6 [化学];

学科分类号：

0703 ;

摘要：

引用

页码：845 / +

页数：1

共 29 条

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[4] SURFACE TOPOLOGY CHANGES DURING ELECTROMIGRATION IN METALLIC THIN FILM STRIPES [J].

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ROSENBERG, R .

THIN SOLID FILMS, 1969, 4 (03) :187-+

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[6] ELECTROMIGRATION-INDUCED FAILURES IN ALUMINUM FILM CONDUCTORS [J].

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[7] ELECTROMIGRATION IN THIN AL FILMS [J].

BLECH, IA ;

MEIERAN, ES .

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[8]

BREITLING HM, 1971, THESIS U FLORIDA

[9]

D'Heurle F., 1970, Applied Physics Letters, V16, P80, DOI 10.1063/1.1653108

[10]

DOAN NV, 1970, J PHYS CHEM SOLIDS, V31, P475

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