INTERCONNECT MATERIALS FOR VLSI CIRCUITS .3. MATERIALS FOR INTERCONNECT LINES

被引：0
|
作者：
PAULEAU, Y [1 ]
机构：
[1] CTR NATL ETUD TELECOMMUN,F-38240 MEYLAN,FRANCE
来源：
SOLID STATE TECHNOLOGY | 1987年 / 30卷 / 06期
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
97
引用
收藏
页码：101 / 105
页数：5
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