THERMO-ACTIVATED CREEP AND STRESS-RELAXATION IN CU AND AL

被引：5
作者：
ALY, AA
PODUS, GN
SIRENKO, AF
机构：
来源：
PHYSICA STATUS SOLIDI A-APPLIED RESEARCH | 1979年 / 53卷 / 02期
关键词：
D O I：
10.1002/pssa.2210530207
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Thermoactivation parameters of plastically deformed monocrystalline and polycrystalline Al and Cu in the temperature range 77 to 473 K are determined using the data about the kinetics of creep and mechanical stress relaxation. Also the characteristics of dislocation structures and the variation of the mobile dislocation density during relaxation processes are estimated. It is shown that the relaxation method gives reasonable values for the internal stress and dislocation mobility in a temperature range up to ≈ 0.3Tm. Copyright © 1979 WILEY‐VCH Verlag GmbH & Co. KGaA
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页码：461 / 467
页数：7
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