MULTI-CHIP ARRAYS - VOLUME ON A SUBSTRATE

被引:0
|
作者
TOPFER, ML
机构
来源
AMERICAN CERAMIC SOCIETY BULLETIN | 1969年 / 48卷 / 08期
关键词
D O I
暂无
中图分类号
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
引用
收藏
页码:808 / &
相关论文
共 50 条
  • [41] Interconnect and sensitivity analysis of multi-chip module
    Shanghai Jiaotong Daxue Xuebao/Journal of Shanghai Jiaotong University, 32 (04): : 80 - 84
  • [42] LOW COST MULTI-CHIP PACKAGE.
    Hubacher, E.M.
    IBM technical disclosure bulletin, 1984, 27 (4 B): : 2348 - 2351
  • [43] Statistical approaches to analyzing multi-chip data
    Johnson, JR
    Hurban, P
    Woessner, J
    Liddell, CM
    MICROARRAYS: OPTICAL TECHNOLOGIES AND INFORMATICS, 2001, 4266 : 199 - 206
  • [44] Clock tree synthesis for multi-chip modules
    Lehther, D
    Sapatnekar, SS
    1996 IEEE/ACM INTERNATIONAL CONFERENCE ON COMPUTER-AIDED DESIGN - DIGEST OF TECHNICAL PAPERS, 1996, : 50 - 53
  • [45] Field programmable multi-chip module (FPMCM)
    Darnauer, Joel
    Garay, Porfirio
    Isshiki, Tsuyoshi
    Ramirez, John
    Dai, Wayne Wei-Ming
    1994, : 1 - 10
  • [46] A multi-chip implementation of cortical orientation hypercolumns
    Choi, TYW
    Shi, BE
    Boahen, KA
    2004 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS, VOL 3, PROCEEDINGS, 2004, : 13 - 16
  • [47] MULTI-CHIP MODULE TEST AND DIAGNOSTIC METHODOLOGY
    CURTIN, JJ
    WAICUKAUSKI, JA
    IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1983, 27 (01) : 27 - 34
  • [48] CLAy field configurable multi-chip module
    Nguyen, LT
    Garverick, T
    Field, C
    1966 INTERNATIONAL CONFERENCE ON MULTICHIP MODULES, PROCEEDINGS, 1996, 2794 : 183 - 186
  • [49] A Multi-chip SiP Package Design Scheme
    Cai, Tiantian
    Xi, Wei
    Suo, Siliang
    Jian, Ganyang
    Yao, Hao
    Yu, Zhengqiang
    PROCEEDINGS OF 2019 IEEE 8TH JOINT INTERNATIONAL INFORMATION TECHNOLOGY AND ARTIFICIAL INTELLIGENCE CONFERENCE (ITAIC 2019), 2019, : 1889 - 1893
  • [50] Multi-chip assembly based on SiP technology
    Gan, Xuchun
    Deng, Jiang
    PROCEEDINGS OF THE 3RD WORKSHOP ON ADVANCED RESEARCH AND TECHNOLOGY IN INDUSTRY (WARTIA 2017), 2017, 148 : 448 - 452