THE INFLUENCE OF MASS-TRANSPORT ON THE DEPOSIT MORPHOLOGY AND THE CURRENT EFFICIENCY IN PULSE PLATING OF COPPER

被引：55

作者：

CHENE, O

LANDOLT, D

机构：

来源：

JOURNAL OF APPLIED ELECTROCHEMISTRY | 1989年 / 19卷 / 02期

关键词：

D O I：

10.1007/BF01062299

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

引用

收藏

页码：188 / 194

页数：7

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