CURING BEHAVIOR AND BONDING PROPERTIES OF THERMOSETTING RESIN ADHESIVES .1. METHODS FOR TRACING THE CURING PROCESSES OF PHENOL-MELAMINE-FORMALDEHYDE ADHESIVES

被引:0
作者
ROH, JK
HIGUCHI, M
SAKATA, I
机构
来源
MOKUZAI GAKKAISHI | 1987年 / 33卷 / 03期
关键词
D O I
暂无
中图分类号
TB3 [工程材料学]; TS [轻工业、手工业、生活服务业];
学科分类号
0805 ; 080502 ; 0822 ;
摘要
引用
收藏
页码:193 / 198
页数:6
相关论文
共 30 条
[21]   Curing behavior of wood adhesives under high-pressure steam .3. Bonding strength of phenolic resin [J].
Umemura, K ;
Tanaka, H ;
Mizuno, Y ;
Kawai, S .
MOKUZAI GAKKAISHI, 1996, 42 (10) :985-991
[22]   Model studies of the curing of resole phenol-formaldehyde resins Part 1. The behaviour of ortho quinone methide in a curing resin [J].
Lenghaus, K ;
Qiao, GG ;
Solomon, DH .
POLYMER, 2000, 41 (06) :1973-1979
[23]   Curing and thermal properties of co-polymerized tannin phenol-formaldehyde resin for bonding wood veneers [J].
Hafiz, Nur Liyana Mohamad ;
Tahir, Paridah Md ;
Hua, Lee Seng ;
Abidin, Zurina Zainal ;
Sabaruddin, Fatimah Athiyah ;
Yunus, Noryuziah Mohd ;
Abdullah, Ummi Hani ;
Khalil, Abdul H. P. S. .
JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, 2020, 9 (04) :6994-7001
[24]   PHYSICAL ASPECTS OF WOOD ADHESIVE BOND FORMATION WITH FORMALDEHYDE BASED ADHESIVES .1. THE EFFECT OF CURING CONDITIONS ON THE PHYSICAL-PROPERTIES OF UREA FORMALDEHYDE FILMS [J].
BOLTON, AJ ;
IRLE, MA .
HOLZFORSCHUNG, 1987, 41 (03) :155-158
[26]   PHENOL-FORMALDEHYDE WOOD ADHESIVES UNDER VERY ALKALINE CONDITIONS .1. BEHAVIOR AND PROPOSED MECHANISM [J].
PIZZI, A ;
STEPHANOU, A .
HOLZFORSCHUNG, 1994, 48 (01) :35-40
[27]   Curing behavior and bonding strength of two-component fast-setting adhesives prepared with phenol-liquefied Cryptomeria japonica wood [J].
Yen-Chun Chen ;
Wen-Jau Lee .
European Journal of Wood and Wood Products, 2018, 76 :1399-1407
[28]   Curing behavior and bonding strength of two-component fast-setting adhesives prepared with phenol-liquefied Cryptomeria japonica wood [J].
Chen, Yen-Chun ;
Lee, Wen-Jau .
EUROPEAN JOURNAL OF WOOD AND WOOD PRODUCTS, 2018, 76 (05) :1399-1407
[29]   HOW OVERDRYING WOOD REDUCES ITS BONDING TO PHENOL-FORMALDEHYDE ADHESIVES - A CRITICAL-REVIEW OF THE LITERATURE .1. PHYSICAL RESPONSES [J].
CHRISTIANSEN, AW .
WOOD AND FIBER SCIENCE, 1990, 22 (04) :441-459
[30]   BONDING SURFACE ACTIVATED HARDWOOD FLAKEBOARD WITH PHENOL-FORMALDEHYDE RESIN .1. PHYSICAL AND MECHANICAL-PROPERTIES [J].
GARDNER, DJ ;
ELDER, TJ .
HOLZFORSCHUNG, 1990, 44 (03) :201-206