DRY ETCHING FOR THE FABRICATION OF INTEGRATED-CIRCUITS IN III-V-COMPOUND SEMICONDUCTORS

被引：0
作者：
COOPER, CB
SALIMIAN, S
DAY, ME
机构：
来源：
SOLID STATE TECHNOLOGY | 1989年 / 32卷 / 01期
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暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
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页码：109 / 112
页数：4
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