PHYSICAL-PROPERTIES, APPLICATION TECHNIQUES, AND CURING CHARACTERISTICS OF RADIATION CURABLE ACRYLOURETHANE COATINGS

被引：1

作者：

MCDOWELL, JR

机构：

来源：

RADIATION PHYSICS AND CHEMISTRY | 1979年 / 14卷 / 3-6期

关键词：

D O I：

10.1016/0146-5724(79)90124-9

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

引用

页码：883 / 891

页数：9

共 50 条

[31] PHYSICAL-PROPERTIES AS INDICATORS OF POPPING CHARACTERISTICS OF MICROWAVE POPCORN
PORDESIMO, LO
ANANTHESWARAN, RC
FLEISCHMANN, AM
LIN, YE
HANNA, MA
JOURNAL OF FOOD SCIENCE, 1990, 55 (05) : 1352 - 1355
[32] THERMAL AND PHYSICAL-PROPERTIES AND ETCHING CHARACTERISTICS OF PI FILMS
ENDO, A
YADA, T
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1985, 132 (01) : 155 - 158
[33] PHYSICAL-PROPERTIES OF DUST GRAINS DEDUCED BY OPTICAL PROBING TECHNIQUES
LEVASSEURREGOURD, AC
IN-SITU IMPACT DETECTION TECHNIQUES, INTERPLANETARY DUST, AND FUTURE MARS EXPLORATION, 1995, 17 (12): : 117 - 122
[34] PHYSICAL-PROPERTIES OF ACRYLIC RESIN POLYMERIZED BY 4 DIFFERENT TECHNIQUES
DONOVAN, TE
HURST, RG
CAMPAGNI, WV
JOURNAL OF PROSTHETIC DENTISTRY, 1985, 54 (04): : 522 - 524
[35] PHYSICAL-PROPERTIES OF NEMATOGENIC LIQUIDS - APPLICATION TO KERR CELLS
FILIPPINI, JC
POGGI, Y
ACTA PHYSICA POLONICA A, 1978, 54 (05) : 659 - 665
[36] THICK-FILM CERMETS, THEIR PHYSICAL-PROPERTIES AND APPLICATION
LICZNERSKI, BW
INTERNATIONAL JOURNAL OF ELECTRONICS, 1990, 69 (01) : 79 - 86
[37] PHYSICAL-PROPERTIES OPTIMIZATION FOR THIN FERROACTIVE FILMS APPLICATION
ROLOV, B
YURKEVICH, V
FERROELECTRICS, 1980, 27 (1-4) : 165 - 165
[38] RAMAN DETERMINATION OF MOLECULAR-STRUCTURE AND PHYSICAL-PROPERTIES OF DIELECTRIC COATINGS
EXARHOS, GJ
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1986, 4 (06): : 2962 - 2968
[39] PHYSICAL-PROPERTIES OF EPOXY-PRIMED POLYETHYLENE AND EPOXY PIPE COATINGS
SHARPE, RE
DICK, RJ
JOURNAL OF COATINGS TECHNOLOGY, 1985, 57 (730): : 25 - 31
[40] CORRELATION BETWEEN MICROSTRUCTURE AND PHYSICAL-PROPERTIES OF PLASMA SPRAYED ZIRCONIA COATINGS
STEFFENS, HD
FISCHER, U
THERMAL SPRAY TECHNOLOGY: NEW IDEAS AND PROCESSES, 1989, : 167 - 173

← 1 2 3 4 5 →