BIAS-INDUCED STRESS TRANSITIONS IN SPUTTERED TIN FILMS

被引:50
作者
KATTELUS, HP [1 ]
TANDON, JL [1 ]
SALA, C [1 ]
NICOLET, MA [1 ]
机构
[1] CALTECH,PASADENA,CA 91125
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS | 1986年 / 4卷 / 04期
关键词
D O I
10.1116/1.573776
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
引用
收藏
页码:1850 / 1854
页数:5
相关论文
共 21 条
[1]   INVESTIGATION OF TIN FILMS REACTIVELY SPUTTERED USING A SPUTTER GUN [J].
AHN, KY ;
WITTMER, M ;
TING, CY .
THIN SOLID FILMS, 1983, 107 (01) :45-54
[2]   EFFECT OF ION-BOMBARDMENT DURING DEPOSITION ON THICK METAL AND CERAMIC DEPOSITS [J].
BLAND, RD ;
KOMINIAK, GJ ;
MATTOX, DM .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1974, 11 (04) :671-674
[3]  
BROWN R, 1970, HDB THIN FILM TECHNO, P6
[4]  
Campbell D. S., 1970, HDB THIN FILM TECHNO, P12
[5]  
EROLA M, SOLAR ENERGY MATERIA
[6]   CONTACT RESISTIVITY OF TIN ON P+-SI AND N+-SI [J].
FINETTI, M ;
SUNI, I ;
NICOLET, MA .
SOLAR CELLS, 1983, 9 (03) :179-183
[7]   SUPPRESSION OF PLATINUM PENETRATION FAILURE IN TI/PT/AU BEAM LEAD METAL SYSTEMS USING A TIN DIFFUSION BARRIER [J].
KANAMORI, S ;
MATZUMOTO, T .
THIN SOLID FILMS, 1983, 110 (03) :205-213
[8]  
KANAMORI S, THIN SOLID FILMS
[9]   DIFFUSION BARRIERS IN THIN-FILMS [J].
NICOLET, MA .
THIN SOLID FILMS, 1978, 52 (03) :415-443
[10]   INFLUENCE OF SUBSTRATE BIAS ON THE COMPOSITION, STRUCTURE AND ELECTRICAL-PROPERTIES OF REACTIVELY DC-SPUTTERED TIN FILMS [J].
POITEVIN, JM ;
LEMPERIERE, G ;
TARDY, J .
THIN SOLID FILMS, 1982, 97 (01) :69-77