Investigation of Friction and Wear Properties of Electroless Ni-P-Cu Coating Under Dry Condition

被引:11
作者
Duari, Santanu [1 ]
Mukhopadhyay, Arkadeb [1 ]
Barman, Tapan Kr. [1 ]
Sahoo, Prasanta [1 ]
机构
[1] Jadavpur Univ, Dept Mech Engn, Kolkata 700032, W Bengal, India
关键词
Electroless Ni-P-Cu coating; hardness; roughness; friction; wear;
D O I
10.1142/S225123731640013X
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
This study presents the deposition and tribological characterization of electroless Ni-P-Cu coatings deposited on AISI 1040 steel specimens. After deposition, coatings are heat treated at 500 degrees C for 1 h. Surface morphology study of the coatings reveals its typical cauliflower like appearance. Composition study of the coatings using energy dispersive X-ray analysis indicates that the deposit lies in the high phosphorus range. The coatings undergo crystallization on heat treatment. A significant improvement in microhardness of the coatings is also observed on heat treatment due to the precipitation of hard crystalline phases. The heat-treated coatings are subjected to sliding wear tests on a pin-on-disc type tribo-tester under dry condition by varying the applied normal load, sliding speed and sliding duration. The coefficient of friction (COF) increases with an increase in the applied normal load while it decreases with an increase in the sliding speed. The wear depth on the other hand increases with an increase in applied normal load as well as sliding speed. The worn surface morphology mainly indicates fracture of the nodules.
引用
收藏
页数:13
相关论文
共 47 条
[1]   Auger electron spectroscopy element profiles and interface with substrates of electroless deposited ternary alloys [J].
Armyanov, S ;
Steenhout, O ;
Krasteva, N ;
Georgieva, J ;
Delplancke, JL ;
Winand, R ;
Vereecken, J .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1996, 143 (11) :3692-3698
[2]   Electroless deposition of Ni-Cu-P alloy and study of the influences of some parameters on the properties of deposits [J].
Ashassi-Sorkhabi, H ;
Dolati, H ;
Parvini-Ahmadi, N ;
Manzoori, J .
APPLIED SURFACE SCIENCE, 2002, 185 (3-4) :155-160
[3]   Studies on electroless Ni-W-P and Ni-W-Cu-P alloy coatings using chloride-based bath [J].
Balaraju, JN ;
Jahan, SM ;
Anandan, C ;
Rajam, KS .
SURFACE & COATINGS TECHNOLOGY, 2006, 200 (16-17) :4885-4890
[4]   Morphological study of ternary Ni-Cu-P alloys by atomic force microscopy [J].
Balaraju, JN ;
Anandan, C ;
Rajam, KS .
APPLIED SURFACE SCIENCE, 2005, 250 (1-4) :88-97
[5]   Electroless deposition of Ni-Cu-P, Ni-W-P and Ni-W-Cu-P alloys [J].
Balaraju, JN ;
Rajam, KS .
SURFACE & COATINGS TECHNOLOGY, 2005, 195 (2-3) :154-161
[6]   Effect of the thickness of an electroless Ni-P deposit on the mechanical properties of an AISI 1045 plain carbon steel [J].
Berrios, JA ;
Staia, MH ;
Hernandez, EC ;
Hintermann, H ;
Puchi, ES .
SURFACE & COATINGS TECHNOLOGY, 1998, 108 (1-3) :466-472
[7]   NICKEL PLATING ON STEEL BY CHEMICAL REDUCTION [J].
BRENNER, A ;
RIDDELL, GE .
JOURNAL OF RESEARCH OF THE NATIONAL BUREAU OF STANDARDS, 1946, 37 (01) :31-34
[8]  
Brenner A., 1950, U.S. Patent, Patent No. 2532282
[9]   Fabrication and crystallization behaviors of sputtered Ni-Cu-P films on tool steel [J].
Chang, YC ;
Duh, JG ;
Chen, YI .
SURFACE & COATINGS TECHNOLOGY, 2001, 139 (2-3) :233-243
[10]   Internal stress and adhesion of amorphous Ni-Cu-P alloy on aluminum [J].
Chen, CJ ;
Lin, KL .
THIN SOLID FILMS, 2000, 370 (1-2) :106-113