A 0.13μm SiGe BiCMOS Technology Featuring fT/fmax of 240/330 GHz and Gate Delays below 3 Ps

被引:26
作者
Ruecker, H. [1 ]
Heinemann, B. [1 ]
Winkler, W. [2 ]
Barth, R. [1 ]
Borngraeber, J. [1 ]
Drews, J. [1 ]
Fischer, G. G. [1 ]
Fox, A. [1 ]
Grabolla, T. [1 ]
Haak, U. [1 ]
Knoll, D. [1 ]
Korndoerfer, F. [1 ]
Mai, A. [1 ]
Marschmeyer, S. [1 ]
Schley, P. [1 ]
Schmidt, D. [1 ]
Schmidt, J. [1 ]
Schulz, K. [1 ]
Tillack, B. [1 ]
Wolansky, D. [1 ]
Yamamoto, Y. [1 ]
机构
[1] IHP, Technol Pk 25, D-15236 Frankfurt, Oder, Germany
[2] Silicon Radar, D-15236 Frankfurt, Germany
来源
PROCEEDINGS OF THE 2009 BIPOLAR/BICMOS CIRCUITS AND TECHNOLOGY MEETING | 2009年
关键词
Terms - Silicon bipolar/BiCMOS process technology; Heterojunction bipolar transistors; Silicon alloys; Millimeter wave bipolar integrated circuits; Millimeter wave devices;
D O I
10.1109/BIPOL.2009.5314251
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A 0.13 mu m SiGe BiCMOS technology for millimeter wave applications is presented. This technology features high-speed Riffs (f(T)=240 GHz, f(max),=330 GHz, BVCEO=1.7 V) along with high-voltage HBTs (f(T)=50 GHz, f(max)=130 GHz, BVCEO=3.7 V) integrated in a dual-gate, triple-well RF-CMOS process. Ring oscillator gate delays of 2.9 ps, low-noise amplifiers for 122 GHz, and LC oscillators for frequencies above 200 GHz are demonstrated.
引用
收藏
页码:166 / +
页数:2
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