MEASUREMENT OF THE INTRINSIC STRESS IN THIN-FILMS OF SILVER BY A NEW CANTILEVERED PLATE TECHNIQUE

被引:9
作者
LAUGIER, M
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D O I
10.1016/0040-6090(81)90398-9
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T [工业技术];
学科分类号
08 ;
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页码:213 / 219
页数:7
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共 21 条
[1]  
Campbell D. S., 1966, BASIC PROBLEMS THIN
[2]  
Campbell DS, 1970, HDB THIN FILM TECHNO
[3]   GRAIN-GROWTH AND STRESS RELIEF IN THIN-FILMS [J].
CHAUDHAR.P .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1972, 9 (01) :520-&
[4]  
Chopra K.L, 1969, THIN FILM PHENOMENA
[5]   ORIGINS OF STRESS IN THIN NICKEL FILMS [J].
DOLJACK, FA ;
HOFFMAN, RW .
THIN SOLID FILMS, 1972, 12 (01) :71-&
[6]   SCANNING ELECTRON DIFFRACTION OF FILM GROWTH [J].
GRIGSON, CWB ;
DOVE, DB .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1966, 3 (03) :120-&
[7]  
HERITAGE MB, 1968, THESIS CAMBRIDGE U G
[8]  
Hoffman R. W., 1966, PHYS THIN FILMS, VVol. 3, pp. 211
[9]   STRESSES IN THIN-FILMS - RELEVANCE OF GRAIN-BOUNDARIES AND IMPURITIES [J].
HOFFMAN, RW .
THIN SOLID FILMS, 1976, 34 (02) :185-190
[10]   STRESS IN VERY THIN VACUUM-EVAPORATED FILMS OF SILVER [J].
KINOSITA, K ;
KONDO, H ;
SAWAMURA, I .
JOURNAL OF THE PHYSICAL SOCIETY OF JAPAN, 1960, 15 (05) :942-943