NEW BUILDUPS IN HIGH-END FIBERS

被引：0
作者：
不详
机构：
来源：
MODERN PLASTICS | 1980年 / 57卷 / 05期
关键词：
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
引用
收藏
页码：14 / 14
页数：1
相关论文
共 50 条
[41]   PENTIUM DEBUTS FOR HIGH-END PORTABLES [J].
MCLEOD, J .
ELECTRONICS-US, 1994, 67 (19) :4-4
[42]   HIGH-END DOT MATRIX PRINTERS [J].
MAKRIAS, S .
PERSONAL COMPUTING, 1986, 10 (11) :149-152
[43]   HIGH-END ALLOYS, BLENDS, COMPOSITES PROMISE NEW OPPORTUNITIES TO USERS [J].
不详 .
MODERN PLASTICS, 1982, 59 (12) :12-&
[44]   High-end CAN controller to respond to the new OSEK/VDX standard [J].
Correia, P ;
Aberl, P .
AUTOMOTIVE ELECTRONICS - AUTOTECH'97, 1997, 97 (10) :41-48
[45]   Steinemann Technology installs new generation of high-end laminating machines [J].
Papier Und Druck, 2006, 112 (11)
[46]   CCD imagers take new pixel approach for high-end applications [J].
Bosiers, Jan ;
Stoldt, Holger ;
Hartog, Peter ;
Klaassens, Wilco ;
Nixon, O. .
LASER FOCUS WORLD, 2008, 44 (04) :65-+
[47]   MAKING IT COMPATIBLE AND BETTER: DESIGNING A NEW HIGH-END COMPUTER. [J].
Appelt, Daren R. .
Electronics, 1979, 52 (32) :131-136
[48]   High-end sensors: challenges for the future [J].
Yurish, Sergey Y. .
JOINT IMEKO TC1-TC7-TC13-TC18 SYMPOSIUM, 2019, 1379
[49]   Angle measurement for high-end applications [J].
Heidenhain, Johannes .
Konstruktion, 2019, 2019 (06) :20-21
[50]   Optical interconnects for high-end systems [J].
Taira Y. .
Journal of Japan Institute of Electronics Packaging, 2017, 20 (05) :302-307
12345