共 50 条
- [31] Creep behavior of lead free solder interconnects in microelectronic packages: Impression creep testing and constitutive modeling [J]. ADVANCES IN ELECTRONIC PACKAGING 2005, PTS A-C, 2005, : 1299 - 1306
- [32] EFFECT OF THERMAL CYCLES ON CREEP PROPERTIES OF ALLOY STEELS FOR TUBES [J]. METALLURGIA, 1968, 78 (469): : 187 - &
- [35] EFFECT OF THERMAL CYCLES ON CREEP PROPERTIES OF ALLOY STEELS FOR TUBES [J]. METALLURGIA, 1969, 79 (471): : 3 - &
- [36] DESIGN OF A NEW EXPERIMENTAL RIG FOR THERMAL CYCLIC TESTING OF COMBUSTOR LINER TILES [J]. PROCEEDINGS OF THE ASME TURBO EXPO 2008, VOL 5, PT A, 2008, : 21 - 30
- [37] EFFECT OF FREQUENCY ON THE CYCLIC CREEP AND FRACTURE OF A LEAD-RICH LEAD-TIN SOLDER ALLOY [J]. SCRIPTA METALLURGICA, 1987, 21 (09): : 1165 - 1168
- [40] Creep-testing foils and sheets of alloy 625 for microturbine recuperators [J]. Superalloys 718, 625, 706 and Derivatives, Proceedings, 2005, : 721 - 721