HEAT-TRANSFER OF MODIFIED SILICON SURFACES

被引：17
|
作者：
REEBER, MD
FRIESER, RG
机构：
来源：
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1980年 / 3卷 / 03期
关键词：
D O I：
10.1109/TCHMT.1980.1135627
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
High density semiconductor packaging technology is considered. The heat transfer between silicon surfaces and perfluorohexane has been measured for fluxes ranging from 0 to 2. 2 W/cm**2. Data are presented for ten different surface treatments designed to encourage thermal nucleation.
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页码：387 / 391
页数：5
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