ENHANCING ULTRASONIC BOND DEVELOPMENT

被引：47
作者：
WINCHELL, VH
BERG, HM
机构：
来源：
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1978年 / 1卷 / 03期
关键词：
D O I：
10.1109/TCHMT.1978.1135291
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
引用
收藏
页码：211 / 219
页数：9
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