THE INTERACTION KINETICS AND COMPOUND FORMATION BETWEEN ELECTROLESS NI-P AND SOLDER

被引：94
|
作者：
LEE, CY
LIN, KL
机构：
[1] Department of Materials Science and Engineering, National Cheng Kung University, Tainan
来源：
THIN SOLID FILMS | 1994年 / 249卷 / 02期
关键词：
D O I：
10.1016/0040-6090(94)90761-7
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The interdiffusion between an electroless Ni-P deposit and liquid solder was investigated with the aid of an X-ray diffractometer and a scanning electron microscope to identify the intermetallic compounds formed. Sn was found to be the dominant diffusing atom in the interdiffusion process according to analysis by Auger electron spectroscopy. The intermetallic compounds Ni3Sn4 and Ni3Sn2 were formed between Ni-P and the solder in which phosphorus was also detected. The kinetics of the formation of intermetallic compounds and the activation energy for the diffusion of Sn were investigated.
引用
收藏
页码：201 / 206
页数：6
相关论文
共 50 条
  • [31] CORROSION RESISTANCE OF ELECTROLESS Ni-P/Cu/Ni-P MULTILAYER COATINGS
    Zhao, G. L.
    Zou, Y.
    Hao, Y. L.
    Zou, Z. D.
    ARCHIVES OF METALLURGY AND MATERIALS, 2015, 60 (02) : 1003 - 1008
  • [32] Influence of P content in electroless plated Ni-P alloy film on interfacial structures and strength between Sn-Zn solder and plated Au/Ni-P alloy film
    Chonan, Y
    Komiyama, T
    Onuki, J
    Urao, R
    Kimura, T
    Nagano, T
    MATERIALS TRANSACTIONS, 2002, 43 (08) : 1887 - 1890
  • [33] Comparative study of the dissolution kinetics of electrolytic Ni and electroless Ni-P by the molten Sn3.5Ag0.5Cu solder alloy
    Islam, MN
    Chan, YC
    Sharif, A
    Alam, MO
    MICROELECTRONICS RELIABILITY, 2003, 43 (12) : 2031 - 2037
  • [34] Transmission electron microscopy of solder joints of Sn-Ag-Cu/electroless Ni-P and Sn-Ag-Cu-Bi/electroless Ni-P of an electronic device
    Torazawa, N
    Arai, S
    Takase, Y
    Sasaki, K
    Saka, H
    JOURNAL OF THE JAPAN INSTITUTE OF METALS, 2002, 66 (11) : 1122 - 1130
  • [35] Effect of accelerators and stabilizers on the formation and characteristics of electroless Ni-P deposits
    Baskaran, I.
    Narayanan, T. S. N. Sankara
    Stephen, A.
    MATERIALS CHEMISTRY AND PHYSICS, 2006, 99 (01) : 117 - 126
  • [36] Electroless amorphous Ni-Cu-P deposit and the interaction between Ni-Cu-P barrier and Sn solder
    Xing, Jing
    Xiao, Siyuan
    Li, Xiaofu
    Yao, Jinye
    Chen, Xiangxu
    Ma, Haitao
    2023 24TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2023,
  • [37] THE PROCESS OF FORMATION OF AMORPHOUS NI-P LAYERS MADE BY ELECTROLESS DEPOSITION
    SZASZ, A
    KOJNOK, J
    KERTESZ, L
    PAAL, Z
    HEGEDUS, Z
    THIN SOLID FILMS, 1984, 116 (1-3) : 279 - 286
  • [38] THE PROPERTIES OF ELECTROLESS NI-P AND NI-P-SIC
    XIAO, CG
    HUANG, XM
    DENG, ZG
    WANG, YW
    PLATING AND SURFACE FINISHING, 1989, 76 (06): : 90 - 93
  • [39] The effect of additional elements on the interfacial structure and strength at the solder joint between Sn-Ag-X solder and electroless Ni-P Planting
    Nakahara, Yuunosuke
    Hira, Kazuo
    Ninomiya, Ryuuji
    Tagami, Michihiro
    Sugai, Mikio
    Nakata, Shinichi
    Yosetsu Gakkai Ronbunshu/Quarterly Journal of the Japan Welding Society, 2003, 21 (01): : 116 - 125
  • [40] Investigation of interfacial reactions between Sn-Ag-Bi-In solder and (Cu, electroless Ni-P/Cu) substrate
    Yoon, JW
    Lee, CY
    Lee, CB
    Yoo, CS
    Jung, SB
    ZEITSCHRIFT FUR METALLKUNDE, 2003, 94 (04): : 453 - 457
12345