SILICON CONTAMINATION OF POLYPROPYLENE FILMS FROM GLASS REACTORS IN A BCL3 RF COLD-PLASMA

被引:1
|
作者
DENES, F
SARMADI, AM
NAYAR, S
YING, TH
HOP, CECA
YOUNG, RA
机构
[1] Department of Forestry, ETD, Chemistry and Engineering Research Center for Plasma-Aided Manufacturing, University of Wisconsin, Madison, 53706, WI
关键词
D O I
10.1007/BF00692963
中图分类号
O63 [高分子化学(高聚物)];
学科分类号
070305 ; 080501 ; 081704 ;
摘要
Cold plasma chemistry can be used for surface modification and/or grafting of polymeric substrates for enhanced properties. In addition to interaction with the substrate, plasma reactions can also occur at other surfaces confined to the reactor. Contamination of polypropylene (PP) substrates with silicon, originating from the reactor walls in a BCl3 plasma, has been shown to occur based on ESCA measurements and the presence of Si-based compounds in the gaseous phase has been shown by GC-MS and high resolution MS for the plasma generated molecular mixture. The Si incorporation is similar to that found with CF4 plasmas where a shorter treatment time resulted in higher Si incorporation. These results indicate that reactor wall-origin contaminations can accompany plasma treatments, interfere with the the main reaction mechanisms and create serious problems for achieving the desired surface properties.
引用
收藏
页码:351 / 358
页数:8
相关论文
共 50 条
  • [31] Effect of gas mixing ratio on etch behavior of ZrO2 thin films in BCl3/He inductively coupled plasma
    Kim, Mansu
    Min, Nam-Ki
    Yun, Sun Jin
    Lee, Hyun Woo
    Efremov, Alexander
    Kwon, Kwang-Ho
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 2008, 26 (03): : 344 - 351
  • [32] SILICON DEPOSITION FROM SICL4 IN A COLD RF PLASMA - THE EFFECT OF DOPING GASES ON DEPOSITION RATES, CHLORINE CONTENT AND THE MORPHOLOGY OF THE FILMS
    MANORY, R
    GROSSMAN, E
    AVNI, R
    GRILL, A
    THIN SOLID FILMS, 1984, 121 (02) : 135 - 141
  • [33] Characteristics of GaN thin films by inductively coupled plasma etching with Cl2/BCl3 and Cl2/Ar
    Yang, G. F.
    Chen, P.
    Wu, Z. L.
    Yu, Z. G.
    Zhao, H.
    Liu, B.
    Hua, X. M.
    Xie, Z. L.
    Xiu, X. Q.
    Han, P.
    Shi, Y.
    Zhang, R.
    Zheng, Y. D.
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2012, 23 (06) : 1224 - 1228
  • [34] Characteristics of GaN thin films by inductively coupled plasma etching with Cl2/BCl3 and Cl2/Ar
    G. F. Yang
    P. Chen
    Z. L. Wu
    Z. G. Yu
    H. Zhao
    B. Liu
    X. M. Hua
    Z. L. Xie
    X. Q. Xiu
    P. Han
    Y. Shi
    R. Zhang
    Y. D. Zheng
    Journal of Materials Science: Materials in Electronics, 2012, 23 : 1224 - 1228
  • [35] TAPERED ETCHING OF ALUMINUM WITH CHF3/CL2/BCL3 AND ITS IMPACT ON STEP COVERAGE OF PLASMA-DEPOSITED SILICON-OXIDE FROM TETRAETHOXYSILANE
    SELAMOGLU, N
    BREDBENNER, CN
    GINIECKI, TA
    STOCKER, HJ
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1991, 9 (05): : 2530 - 2535
  • [36] Modeling of the boron emitter formation process from BCl3 diffusion for N-type silicon solar cells processing
    Armand, J.
    Oliver, C.
    Martinez, F.
    Semmache, B.
    Gauthier, M.
    Foucaran, A.
    Cuminal, Y.
    ADVANCES IN INNOVATIVE MATERIALS AND APPLICATIONS, 2011, 324 : 261 - +
  • [37] ADSORPTION OF PCL5 ALCL3 AND PCL5 BCL3 COMPLEXES FROM SOLUTIONS IN SILICON AND CARBON TETRACHLORIDES
    ERSHOVA, GG
    MARTYNOV, YM
    ZHURNAL PRIKLADNOI KHIMII, 1971, 44 (08) : 1882 - +
  • [38] Plasma etching of (Ba,Sr)TiO3 thin films using inductively coupled Cl2/Ar and BCl3/Cl2/Ar plasma
    Kim, GH
    Kim, KT
    Kim, DP
    Kim, CI
    THIN SOLID FILMS, 2005, 475 (1-2) : 86 - 90
  • [39] RF PLASMA DEPOSITION OF AMORPHOUS-SILICON FILMS FROM SICL4-H2
    BRUNO, G
    CAPEZZUTO, P
    CRAMAROSSA, F
    DAGOSTINO, R
    THIN SOLID FILMS, 1980, 67 (01) : 103 - 107
  • [40] Preparation of Silicon Thin Films of Different Phase Composition from Monochlorosilane as a Precursor by RF Capacitive Plasma Discharge
    Mochalov, L. A.
    Kornev, R. A.
    Nezhdanov, A. V.
    Mashin, A. I.
    Lobanov, A. S.
    Kostrov, A. V.
    Vorotyntsev, V. M.
    Vorotyntsev, A. V.
    PLASMA CHEMISTRY AND PLASMA PROCESSING, 2016, 36 (03) : 849 - 856